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公开(公告)号：EP0642412B1
公开(公告)日：2003-08-13
申请号：EP93911363.5
申请日：1993-05-20
发明人： MAOZ, Joseph , KADISHEVITZ, Michael
CPC分类号： B32B15/046 , B32B5/18 , B32B7/12 , B32B15/08 , B32B15/20 , B32B2266/0228 , B32B2457/08 , H05K1/032 , H05K1/0346
摘要： A printed circuit board having foamed substrates of low dielectric constant and low dissipation factor and techniques for making printed circuit boards and printed circuits using such substrates. The substrate has a dielectric constant less than 1.5 and a dissipation factor less than 10 , most preferably, polymethylacrylimide. A conductive layer is placed on the substrate surface using chemical deposition or by use of appropriate adhesives. The printed circuit may be imprinted by conventional techniques such as etching with appropriate etching materials.
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公开(公告)号：EP0642412A1
公开(公告)日：1995-03-15
申请号：EP93911363.0
申请日：1993-05-20
发明人： MAOZ, Joseph , KADISHEVITZ, Michael
CPC分类号： B32B15/046 , B32B5/18 , B32B7/12 , B32B15/08 , B32B15/20 , B32B2266/0228 , B32B2457/08 , H05K1/032 , H05K1/0346
摘要： A printed circuit board having foamed substrates of low dielectric constant and low dissipation factor and techniques for making printed circuit boards and printed circuits using such substrates. The substrate has a dielectric constant less than 1.5 and a dissipation factor less than 10-2, most preferably, polymethylacrylimide. A conductive layer is placed on the substrate surface using chemical deposition or by use of appropriate adhesives. The printed circuit may be imprinted by conventional techniques such as etching with appropriate etching materials.
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