公开(公告)号：EP3186416A4

公开(公告)日：2018-04-11

申请号：EP15830311

申请日：2015-08-04

申请人： MACDERMID ACUMEN INC

发明人： CHAPANERI ROSHAN V ,  PEARSON TREVOR ,  HERDMAN RODERICK D ,  HYSLOP ALISON

IPC分类号： C25D5/54 ,  C09D181/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C25D5/56 ,  C25D17/08 ,  C25D21/11

CPC分类号： C25D17/08 ,  C09D181/00 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C25D5/34

摘要： A method of coating an electroplating rack used for supporting non-conductive substrates during a plating process. The method comprises the steps of contacting at least a portion of the electroplating rack with a plastisol composition, the plastisol composition having dispersed therein an effective amount of an additive; and heating the electroplating rack with the plastisol composition thereon to a suitable temperature and for a sufficient time to cure the plastisol and form a solid insulating coating on the electroplating rack. The coated electroplating rack may then be used for mounting non-conductive substrates for subsequent metallization steps.

公开(公告)号：EP2920341A4

公开(公告)日：2016-04-27

申请号：EP13854930

申请日：2013-09-26

申请人： MACDERMID ACUMEN INC

发明人： PEARSON TREVOR ,  CLARKE TERENCE ,  CHAPANERI ROSHAN V

IPC分类号： C25B11/02 ,  C25B11/03 ,  C25B11/12

CPC分类号： C25B11/02 ,  C23C18/1653 ,  C23C18/24 ,  C25B1/21 ,  C25B11/03 ,  C25B11/12

摘要： An electrolytic cell and a method of electrochemical oxidation of manganese (II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises ( 1 ) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

公开(公告)号：EP3108039A4

公开(公告)日：2017-10-18

申请号：EP15752252

申请日：2015-01-16

申请人： MACDERMID ACUMEN INC

发明人： HERDMAN RODERICK D ,  CHAPANERI ROSHAN V ,  HYSLOP ALISON

IPC分类号： C25D5/54 ,  C23C18/16 ,  C25D5/56 ,  C25D17/08

CPC分类号： C25D17/08 ,  C23C18/163

摘要： An electroplating rack for supporting non-conductive substrates during an electrodeposition process is described. The electroplating rack is coated with a non-conductive material, such as a PVC plastisol. The electroplating rack is treated with a non-aqueous solution comprising a metallization inhibitor prior to the electrodeposition process to inhibit rack plate up when using etchants that do not contain chromic acid.

公开(公告)号：EP2971260A4

公开(公告)日：2017-04-19

申请号：EP14779082

申请日：2014-03-07

申请人： MACDERMID ACUMEN INC

发明人： PEARSON TREVOR ,  CLARKE TERENCE ,  CHAPANERI ROSHAN V ,  ROBINSON CRAIG ,  HYSLOP ALISON ,  SINGH AMRIK

IPC分类号： C25C1/10 ,  C23C18/20 ,  C23C18/24 ,  C25B1/21 ,  C25B11/04 ,  C25B11/12 ,  C25B15/02 ,  C25D5/56

CPC分类号： C25B1/21 ,  C23C18/2086 ,  C23C18/24 ,  C25B11/0473 ,  C25B11/12 ,  C25B15/02 ,  C25D5/56

摘要： An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of at least one acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, woven carbon fibers, lead and lead alloy. Once the electrolyte is oxidized to form a metastable complex of manganese(III) ions, a platable plastic may be contacted with the metastable complex to etch the platable plastic. In addition, a pretreatment step may also be performed on the platable plastic prior to contacting the platable plastic with the metastable complex to condition the plastic surface.

摘要翻译： 描述了电解槽中的电解槽和锰（II）离子向锰（III）离子电化学氧化的方法。 电解池包括（1）锰（II）离子在至少一种酸的溶液中的电解液; （2）浸入电解液中的阴极; 和（3）浸在电解质溶液中并与阴极隔开的阳极。 描述了各种阳极材料，包括玻璃碳，网状玻璃碳，编织碳纤维，铅和铅合金。 一旦电解质被氧化形成锰（III）离子的亚稳态络合物，可以将平板状塑料与亚稳态络合物接触以蚀刻可镀塑料。 此外，在将可镀塑料与亚稳态复合物接触之前，也可以对可镀塑料进行预处理步骤以调节塑料表面。

公开(公告)号：EP2760595A4

公开(公告)日：2015-07-15

申请号：EP12835615

申请日：2012-08-16

申请人： MACDERMID ACUMEN INC

发明人： CHAPANERI ROSHAN V ,  WALL ANTHONY ,  PEARSON TREVOR ,  HERDMAN RODERICK D

IPC分类号： B05D3/04 ,  C23C18/20 ,  C23C18/24 ,  C23C18/30 ,  C23C18/32

CPC分类号： C23C22/73 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/30 ,  C23C18/32

摘要： A process for plating metal on plastic substrates, particularly ABS substrates, without the use of chrome containing etchants is disclosed. The process involves (i) etching the plastic substrate in an acidic solution of nitrate ions, and preferably silver ions, (ii) conditioning the substrate in an aqueous solution containing an amine or ammonia, (iii) activating the substrate, preferably with a palladium activator, and (iv) plating the substrate with an electroless plating solution. The process allows for complete adherent electroless plating of plastic substrates, particularly ABS substrates, without the use of chromic etchants.