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公开(公告)号：EP1229770A1
公开(公告)日：2002-08-07
申请号：EP01934557.8
申请日：2001-06-05
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
摘要翻译： 一种制造PCB的方法，包括以下步骤：在前面和背面上形成具有释放层的基板中形成通孔; 在通孔中填充导电膏; 去除释放层并在金属箔的两个面上设置金属箔; 并热压它们。 通孔的直径大于形成在释放层上的相应孔的直径。 根据本发明，当导电膏被压缩时，从基板的表面突出的导电糊被捕获在通孔的边缘处。 这种配置可以防止出现不良布线图形的短路。 因此，足够量的导电糊可以从基板的表面突出。 因此，在压缩之后，确保导电性浆料内部和导电性糊料与金属箔之间的稳定的电连接，能够制造出具有优异的可靠性的PCB。
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公开(公告)号：EP1229770B1
公开(公告)日：2006-11-22
申请号：EP01934557.8
申请日：2001-06-05
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A PCB manufacturing method comprising: forming through holes in a substrate having parting layers formed on its front and back surfaces; filling the through holes with a conductive paste; removing the parting layers and arranging metal foils on the front and back surfaces of the substrate; and heating and compressing them to manufacture a PCB, wherein the through holes in the front and back surfaces of the substrate have diameters larger than those in the corresponding parting layers. When the conductive paste compresses, according to this method, the outflow of the conductive paste from the surface of the substrate stops at the boundary portions of the through holes so that the protrusion of the conductive paste from the substrate surface can be ensured while eliminating the short-circuit with other wiring patterns. Even after the substrate compression, therefore, the electric connections of the inside of the conductive paste and between the conductive paste and the metal foils can be improved to manufacture a highly reliable PCB.
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3.发明公开CIRCUIT FORMING BOARD PRODUCING METHOD, CIRCUIT FORMING BOARD, AND MATERIAL FOR CIRCUIT FORMING BOARD 有权METHOD FOR循环训练板，线路板培训和材料循环训练板
公开(公告)号：EP1267595A1
公开(公告)日：2002-12-18
申请号：EP01974853.2
申请日：2001-10-15
发明人： YAMANE, Shigeru , KAWAMOTO, Eiji , KOMODA, Hideaki , SUZUKI, Takeshi , NISHII, Toshihiro , NAKAMURA, Shinji
CPC分类号： B32B5/14 , B32B15/08 , H05K1/036 , H05K1/0366 , H05K3/4069 , H05K2201/0245 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49156 , Y10T428/24273 , Y10T428/24917 , Y10T428/249924 , Y10T428/24994 , Y10T428/249962 , Y10T428/249995 , Y10T428/2839 , Y10T442/2984 , Y10T442/607
摘要： A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.
摘要翻译： 一包覆板的制造方法，包括：粘附释放电影预浸渍片材; 形成非贯通孔或贯通孔的预浸渍片，其包括将脱模膜; 填充有导电糊的孔; 剥离膜; 和加热和加压将金属箔走上预浸片。 包覆板具有平滑的面形成在一个面或预浸渍片材的两面，从而DASS死导电膏扩散在预浸渍片和释放电影之间的接口约束。 这种结构能够避免电路之间的短路，并防止降低绝缘可靠性。 其结果是，产率的速率得到提高，并有可靠的电路板可获得A.
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