摘要:
A method of manufacturing an inexpensive fine resistor which eliminates the need for dimensional classifications of substrates is disclosed. The method eliminates a step of replacing a mask according to the dimensional rank of the substrate. The method comprises: forming a plurality of pairs of layers made mainly of gold on an insulated substrate sheet; forming a plurality of pairs of top electrode layers made mainly of silver, said top electrode layers being electrically coupled to said plurality of pairs of layers made mainly of gold; forming a plurality of resistor layers being electrically coupled to said plurality of pairs of top electrode layers; and dividing said insulated substrate sheet into a plurality of substrate strips, by cutting through said insulated substrate sheet and said plurality of pairs of layers made mainly of gold along portions of said insulated substrate sheet having said plurality of pairs of layers made mainly of gold formed thereon, by a dicing process, such that said top electrode layers are not cut.
摘要:
A method of manufacturing an inexpensive fine resistor which eliminates the need for dimensional classifications of substrates is disclosed. The method eliminates a step of replacing a mask according to the dimensional rank of the substrate. The method comprises: forming a plurality of pairs of top electrode layers and a plurality of resistor layers on a top face of an insulated substrate sheet, said top electrode layers and said resistor layers being electrically coupled; applying trimming for adjusting a resistance in said resistor layers between said plurality of pairs of top electrode layers; forming a protective layer for covering at least said plurality of resistor layers; forming a plurality of first slit dividing portions for dividing said insulated substrate sheet into a plurality of substrate strips; disposing a mask on a rear face of said insulated substrate sheet; forming a plurality of pairs of side electrode layers by sputtering on a rear face of the insulated substrate sheet and an inner face of said plurality of first slit dividing portions while said mask being disposed; removing said mask from the rear face of said insulated substrate sheet after forming said side electrode layers; and forming a plurality of second dividing portions perpendicular to said first slit dividing portions for dividing the insulated substrate sheet into discrete substrates by separating said plurality of resistor layers to individual resistor layers.