公开(公告)号：EP1981041A2

公开(公告)日：2008-10-15

申请号：EP08161552.8

申请日：2001-01-17

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： Hashimoto, Masato Matsushita Electric Industrial Co., Ltd. ,  Morimoto, Yoshiro Matsushita Electric Industrial Co., Ltd. ,  Fukuoka, Akio Matsushita Electric Industrial Co., Ltd. ,  Kaito, Hiroaki Matsushita Electric Industrial Co., Ltd. ,  Saikawa, Hiroyuki Matsushita Electric Industrial Co., Ltd. ,  Matsukawa, Toshiki Matsushita Electric Industrial Co., Ltd. ,  Hayase, Junichi Matsushita Electric Industrial Co., Ltd.

IPC分类号： H01C7/00 ,  H01C17/00 ,  H01C17/075

CPC分类号： H01C17/006 ,  H01C1/14 ,  H01C1/148 ,  H01C7/001 ,  H01C17/075 ,  H01C17/283 ,  H01C17/288 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49098 ,  Y10T29/49099 ,  Y10T29/49101

摘要： A method of manufacturing an inexpensive fine resistor which eliminates the need for dimensional classifications of substrates is disclosed. The method eliminates a step of replacing a mask according to the dimensional rank of the substrate. The method comprises: forming a plurality of pairs of top electrode layers and a plurality of resistor layers on a top face of an insulated substrate sheet, said top electrode layers and said resistor layers being electrically coupled; applying trimming for adjusting a resistance in said resistor layers between said plurality of pairs of top electrode layers; forming a protective layer for covering at least said plurality of resistor layers; forming a plurality of first slit dividing portions for dividing said insulated substrate sheet into a plurality of substrate strips; disposing a mask on a rear face of said insulated substrate sheet; forming a plurality of pairs of side electrode layers by sputtering on a rear face of the insulated substrate sheet and an inner face of said plurality of first slit dividing portions while said mask being disposed; removing said mask from the rear face of said insulated substrate sheet after forming said side electrode layers; and forming a plurality of second dividing portions perpendicular to said first slit dividing portions for dividing the insulated substrate sheet into discrete substrates by separating said plurality of resistor layers to individual resistor layers.

摘要翻译： 公开了一种制造便宜的精密电阻器的方法，其消除了对基底的尺寸分类的需要。 该方法消除了根据衬底的尺寸等级替换掩模的步骤。 所述方法包括：在绝缘衬底片的顶面上形成多对顶部电极层和多个电阻器层，所述顶部电极层和所述电阻器层电耦合; 施加调整以调整所述多对顶部电极层之间的所述电阻器层中的电阻; 形成至少覆盖所述多个电阻层的保护层; 形成多个第一缝隙分隔部分，用于将所述绝缘衬底片分成多个衬底条; 将掩模设置在所述绝缘衬底片的背面上; 在布置所述掩模的同时，通过溅射在所述绝缘基板片的背面和所述多个第一狭缝分隔部的内面上形成多对侧电极层; 在形成所述侧电极层之后，从所述绝缘基片的背面除去所述掩模; 以及通过将所述多个电阻层分离成单独的电阻层，形成垂直于所述第一缝隙分隔部分的多个第二分隔部分，用于将绝缘衬底片分隔成不连续的衬底。