摘要:
A subject of the present invention is to provide a parts supplying system and a method for the same, capable of preventing exposure of an adhesive face of the top tape even if a fold is displaced, and capable of removing simply and collectively the recovered top tape wound on a reel member. In the present invention, a top tape carrying portion 1 includes a lifting roller 6 for lifting a predetermined length of the top tape by almost 90 degree to direct respective adhesive faces on both ends inwardly, a folding roller 5 for folding the top tape by tilting a lifted top tape toward a not-lifted top tape, and a tape discharging portion 18 for feeding the folded top tape every predetermined pitch. Also, a reel member for recovering the released top tape makes it possible to push out collectively the wound top tape group along the axial direction.
摘要:
In an electronic component feeding apparatus (41) for feeding components with use of a taping component (3), a brushless motor is used as a drive motor (110) in a tape sending mechanism (43) that transports the taping component (3) so as to improve productivity in an electronic component mounting apparatus equipped with the electronic component feeding apparatus (41). Also, an electronic component feeding apparatus (241, 371) is provided with a control part (255, 355) that automatically executes initial processing such as sending of the taping component (3) as well as detects and reports sending failure of the taping component (3) when the electronic component feeding apparatus (241, 371) is installed in the electronic component mounting apparatus, which makes it possible to provide an electronic component feeding apparatus enabling easy and prompt detection of sending failure of the taping component (3).
摘要:
The invention presents an adhesive not impairing components poor in heat resistance in heating and curing, excellent in storage stability, and free from sagging due to heating. Comprising 100 parts by weight of an epoxy resin having a content of mononuclear components of 87 to 100% by weight, 20 to 80 parts by weight of a latent curing agent, 2 to 40 parts by weight of an inorganic filler, 1 to 15 parts by weight of a thixotropic agent, and 0.1 to 5 parts by weight of a pigment, the epoxy resin and latent curing agent are preliminarily dispersed, heated, dissolved and cooled, and then the inorganic filler, thixotropic agent and pigment are dispersed to prepare.