公开(公告)号：EP0866109A1

公开(公告)日：1998-09-23

申请号：EP96941169.3

申请日：1996-12-04

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： MIYAKAWA, Hidenori ,  SUETSUGU, Kenichirou ,  FUKUSHIMA, Tetsuo ,  OKAWA, Koji

IPC分类号： C09J163/00 ,  H05K3/34

CPC分类号： C09J163/00 ,  H05K3/305 ,  H05K2201/0209 ,  Y02P70/613

摘要： The invention presents an adhesive not impairing components poor in heat resistance in heating and curing, excellent in storage stability, and free from sagging due to heating.
Comprising 100 parts by weight of an epoxy resin having a content of mononuclear components of 87 to 100% by weight, 20 to 80 parts by weight of a latent curing agent, 2 to 40 parts by weight of an inorganic filler, 1 to 15 parts by weight of a thixotropic agent, and 0.1 to 5 parts by weight of a pigment, the epoxy resin and latent curing agent are preliminarily dispersed, heated, dissolved and cooled, and then the inorganic filler, thixotropic agent and pigment are dispersed to prepare.

摘要翻译： 本发明提出到粘合剂不损害耐热性差在加热和固化，具有优异的储存稳定性，并从由于加热流挂游离组分。 通过对具有按重量计的潜伏性固化剂的87〜100％，20至80份单核体含量环氧树脂包括100重量份的重量的2〜40重量份的无机填料，1至15份 （重量）的触变剂，和0.1〜5重量份的颜料的，环氧树脂和潜在性硬化剂的预先分散，加热，溶解，冷却，然后将无机填料，触变剂和颜料分散以制备。