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公开(公告)号：EP1049186B1
公开(公告)日：2007-05-16
申请号：EP99970793.8
申请日：1999-10-12
发明人： TAKADA, Kazunori , IWAMOTO, Kazuya , KONDO, Shigeo , TAKEUCHI, Yasumasa , YASUDA, Naoshi , MASAKA, Fusazumi
CPC分类号： H01M10/052 , H01M4/13 , H01M4/621 , H01M6/181 , H01M10/0562
摘要： A molded solid electrolyte comprising a polymer composition comprising 50 to 100 wt.% 1,2-polybutadiene having a 1,2-vinyl bond content of 70 % or higher and a crystallinity of 5 to 50 % and 0 to 50 wt.% polar rubber. The molded electrolyte combines high ionic conductivity with high processability, while the molded electrode has high electrode activity. By using the electrolyte and the electrode, an electrochemical element having excellent operating characteristics can be obtained.
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2.发明公开SOLID ELECTROLYTIC MOLDINGS, ELECTRODE MOLDINGS, AND ELECTROCHEMICAL ELEMENTS 有权AUS FESTEM ELEKTROLYTEN HERGESTELLTESFORMSTÜCK，ELEKTRODENFOMSTÜCKUND ELEKTROCHEMISCHE ELEMENTE
公开(公告)号：EP0977296A1
公开(公告)日：2000-02-02
申请号：EP98940665.7
申请日：1998-08-31
发明人： TAKADA, Kazunori , IWAMOTO, Kazuya , KONDO, Shigeo , YASUDA, Naoshi , MASAKA, Fusazumi , TAKEUCHI, Yasumasa
CPC分类号： H01M10/0562 , H01M4/02 , H01M4/621 , H01M4/622 , H01M6/16 , H01M6/181 , H01M10/052 , H01M10/0565
摘要： Disclosed are a molded solid electrolyte and molded electrode having excellent electrochemical properties and high procesability. As a binder for these molded articles, a hydrogenated block copolymer is used which is obtained by hydrogenating a straight chain or branched block copolymer containing a block (A) comprising polybutadiene whose 1,2-vinyl bond content is 15% or less and a block (B) comprising a butadiene (co)polymer consisting of 50 to 100 % by weight of butadiene and 0 to 50 % by weight of other monomers in which 1,2-vinyl bond content of butadiene portion is 20 to 90%, wherein (A) / (B) = 5 to 70 / 95 to 30 % by weight.
摘要翻译： 公开了具有优异的电化学性能和高可处理性的模制固体电解质和模塑电极。 作为这些成型品的粘合剂，使用氢化嵌段共聚物，该氢化嵌段共聚物通过氢化包含含有1,2-乙烯基键含量为15％以下的聚丁二烯的嵌段（A）的直链或支链嵌段共聚物和嵌段 （B）包含丁二烯（共）聚合物，其由丁二烯50-100重量％和丁基部分的1,2-乙烯基键含量为20至90重量％的其它单体0至50重量％组成，其中（ A）/（B）= 5〜70/95〜30重量％。
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3.发明公开MOLDED SOLID ELECTROLYTE, MOLDED ELECTRODE, AND ELECTROCHEMICAL ELEMENT 有权GEFORMTER FESTER ELEKTROLYT，GEFORMTE ELEKTRODE UND ELEKTROCHEMISCHES ELEMENT
公开(公告)号：EP1049186A1
公开(公告)日：2000-11-02
申请号：EP99970793.8
申请日：1999-10-12
发明人： TAKADA, Kazunori , IWAMOTO, Kazuya , KONDO, Shigeo , TAKEUCHI, Yasumasa , YASUDA, Naoshi , MASAKA, Fusazumi
CPC分类号： H01M10/052 , H01M4/13 , H01M4/621 , H01M6/181 , H01M10/0562
摘要： The present invention discloses a molded solid electrolyte, a molded electrode and an electrochemical device which contain a polymer composition consisting of 50 to 100 wt% of 1,2-polybutadiene having a 1,2-vinyl content of 70% or more and a crystallinity of 5 to 50%, and 0 to 50 wt% of polar rubber. According to the present invention, it becomes possible to obtain a molded solid electrolyte provided with high ionic conductivity and high workability, or a molded electrode having high electrode activity, and it is also possible to obtain an electrochemical device showing excellent activating properties by using the molded solid electrolyte and the molded electrode.
摘要翻译： 本发明公开了一种模塑固体电解质，模制电极和电化学装置，其包含由50-100重量％的1,2-乙烯基含量为70％以上的1,2-聚丁二烯和结晶度 5〜50％，0〜50重量％的极性橡胶。 根据本发明，可以获得具有高离子导电性和高加工性的成型固体电解质或具有高电极活性的模制电极，并且还可以获得通过使用 模制固体电解质和模制电极。
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4.发明授权
公开(公告)号：EP1087428B1
公开(公告)日：2008-05-21
申请号：EP00912945.3
申请日：2000-03-29
发明人： SEKI, Shunichi, Seiko Epson Corporation , SHIMODA, Tatsuya , MIYASHITA, Satoru , FURUSAWA, Masahiro , YUDASAKA, Ichio , MATSUKI, Yasuo , TAKEUCHI, Yasumasa
IPC分类号： H01L21/208 , C01B33/02
CPC分类号： C23C18/06 , C08G77/60 , C09D183/16 , C23C18/08 , H01L21/0242 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/02628 , H01L21/02636 , H01L29/6675 , H01L51/0005 , Y02P20/582
摘要： A method for forming a silicon film which comprises discharging an ink composition (11) selectively onto a predetermined region of a substrate using an ink jet head (12) to form a pattern of a silicon precursor, and then subjecting the pattern to a treatment by heat and/or light to convert the silicon precursor to an amorphous silicon film or a poly-crystal silicon film. The method can be used for providing a silicon film pattern on a large area portion of a substrate with saving energy with a low cost.
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公开(公告)号：EP1087428A1
公开(公告)日：2001-03-28
申请号：EP00912945.3
申请日：2000-03-29
发明人： SEKI, Shunichi, Seiko Epson Corporation , SHIMODA, Tatsuya , MIYASHITA, Satoru , FURUSAWA, Masahiro , YUDASAKA, Ichio , MATSUKI, Yasuo , TAKEUCHI, Yasumasa
IPC分类号： H01L21/208 , C01B33/02
CPC分类号： C23C18/06 , C08G77/60 , C09D183/16 , C23C18/08 , H01L21/0242 , H01L21/02532 , H01L21/02576 , H01L21/02579 , H01L21/02628 , H01L21/02636 , H01L29/6675 , H01L51/0005 , Y02P20/582
摘要： An ink composition 11 containing a silicon precursor is selectively discharged into predetermined regions on a substrate from an ink jet head 12 to form a pattern of the silicon precursor, and is subjected to a heat and/or light treatment to convert the silicon precursor into an amorphous silicon film 15 or a polycrystalline silicon film 16. A silicon film pattern is thereby obtained on a large area at low cost with low energy.
摘要翻译： 含有硅前体的油墨组合物11被选择性地放电到预定区域上的衬底从喷墨头12，以形成硅前体的图案，并且经受一个热和/或光处理以将硅前体转化成在 非晶硅膜-15或多晶硅膜16的有机硅膜图案以低成本且低能量由此获得在大面积上。
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6.发明授权SOLID ELECTROLYTIC MOLDINGS, ELECTRODE MOLDINGS, AND ELECTROCHEMICAL ELEMENTS 有权从产出配件，ELEKTRODENFOMSTÜCK及电化学元件中固体电解质
公开(公告)号：EP0977296B1
公开(公告)日：2010-02-17
申请号：EP98940665.7
申请日：1998-08-31
发明人： TAKADA, Kazunori , IWAMOTO, Kazuya , KONDO, Shigeo , YASUDA, Naoshi , MASAKA, Fusazumi , TAKEUCHI, Yasumasa
CPC分类号： H01M10/0562 , H01M4/02 , H01M4/621 , H01M4/622 , H01M6/16 , H01M6/181 , H01M10/052 , H01M10/0565
摘要： Solid electrolytic moldings and electrode moldings each having excellent electrochemical properties and a high moldability. The binders used for these moldings are hydrogenated block copolymers obtained by hydrogenating a linear or branched block copolymer comprising (A) a polybutadiene block having a 1,2-vinyl bond content of not higher than 15 % and (B) a butadiene (co)polymer block comprising 50 to 100 % by weight of butadiene and 0 to 50 % by weight of another monomer, wherein the 1,2-vinyl bond content of butadiene is 20 to 90 %, and the weight ratio of (A) to (B) is 5/95 to 70/30.
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