公开(公告)号：EP3163616A1

公开(公告)日：2017-05-03

申请号：EP16192005

申请日：2016-10-03

申请人： MEDIATEK INC

发明人： LIAO CHUN-NENG ,  CHIANG MENG-HSIN ,  CHANG CHUN-WEI ,  UNG CHEE-KONG ,  LI CHING-CHIH

IPC分类号： H01L25/16 ,  H01L23/64 ,  H03H7/06

CPC分类号： H03K5/1252 ,  H01L23/642 ,  H01L23/647 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A semiconductor integrated circuit device includes a chip main circuit and a damper. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The damper is coupled between the chip main circuit and a passive component for suppressing anti-resonance of the semiconductor integrated circuit device.

摘要翻译： 一种半导体集成电路器件包括芯片主电路和阻尼器。 芯片主电路连接到电源并执行预定功能。 阻尼器连接到芯片主电路的输出端。 阻尼器耦合在芯片主电路和无源部件之间，用于抑制半导体集成电路器件的反谐振。