公开(公告)号：EP1854132A2

公开(公告)日：2007-11-14

申请号：EP06736536.1

申请日：2006-03-01

申请人： METROLOGIC INSTRUMENTS, INC.

发明人： FORBES, Charles ,  GELBMAN, Alexander ,  TURNER, Christopher ,  GLESKOVA, Helena ,  WAGNER, Sigurd

IPC分类号： H01L21/027

CPC分类号： H01L29/78603 ,  G02F1/133305 ,  G02F1/167 ,  G02F2001/136295 ,  G03G15/6585 ,  H01L21/4846 ,  H01L21/76838 ,  H01L27/1288 ,  H01L29/66757 ,  H01L2924/0002 ,  H05K3/048 ,  H05K3/1266 ,  H05K3/184 ,  H05K3/388 ,  H05K2203/0517 ,  H01L2924/00

摘要： The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

摘要翻译： 本发明提供一种使用电子照相成像化合物作为掩模来形成与衬底的第一表面和具有导电性质的层的表面接触的粘附层的方法。 粘合层改善了导电层与基底的层压特性。 改进的层压特性以促进和增加具有根据本发明形成的电子电路的最终产品的可靠性和质量。 本文公开的方法非常适合与刚性聚合物基材和柔性聚合物基材一起使用。