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1.发明授权DEVICE AND METHOD FOR TESTING INTEGRATED CIRCUIT DICE IN AN INTEGRATED CIRCUIT MODULE 失效方法和设备测试的集成电路芯片的集成化的电路模块
公开(公告)号：EP0928486B1
公开(公告)日：2001-11-14
申请号：EP97938416.1
申请日：1997-08-20
IPC分类号： G11C29/00 , G06F11/267
CPC分类号： H01L22/22 , G01R31/2884 , G11C29/46 , G11C29/785 , G11C29/80 , G11C29/808 , H01L2224/48091 , H04J2203/0062 , H01L2924/00014
摘要： An IC module (20), such as a Multi-Chip Module (MCM), includes multiple IC (12) dice each having a test mode enable bond pad (30), such as an output enable pad. A fuse incorporated into the MCM's substrate connects each dice's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing, includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
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2.发明公开DEVICE AND METHOD FOR TESTING INTEGRATED CIRCUIT DICE IN AN INTEGRATED CIRCUIT MODULE 失效方法和设备测试的集成电路芯片的集成化的电路模块
公开(公告)号：EP0928486A1
公开(公告)日：1999-07-14
申请号：EP97938416.0
申请日：1997-08-20
CPC分类号： H01L22/22 , G01R31/2884 , G11C29/46 , G11C29/785 , G11C29/80 , G11C29/808 , H01L2224/48091 , H04J2203/0062 , H01L2924/00014
摘要： An IC module (20), such as a Multi-Chip Module (MCM), includes multiple IC (12) dice each having a test mode enable bond pad (30), such as an output enable pad. A fuse incorporated into the MCM's substrate connects each dice's test mode enable pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable pads to one of the MCM's reference voltage pins. By applying a supply voltage to the test mode enable pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a reference voltage applied to the test mode enable pads through the reference voltage pins and the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing, includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the re-tested dice, and evaluating the response signals to confirm all repairs.
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