摘要:
Hot-melt processable adhesive, such as pressure-sensitive-adhesive (PSA) or heat-activatable adhesive, compositions of the present invention possess a broad formulation latitude and adequate cohesive strength after application for use in high performance applications. Hot-melt processable adhesives of the invention comprise at least one block copolymer comprising at least two A blocks and at least one B block. The A and B blocks are derived from monoethylenically unsaturated monomers, which monomers result in saturated polymer backbones without the need for subsequent hydrogenation upon their polymerization. Preferably, the block copolymer is a (meth)acrylate block copolymer.
摘要:
A wet stick pressure sensitive adhesive comprising the solventless polymerization product of: a) about 30 to about 70 parts by weight of an (meth)acrylate ester monomer wherein the (meth)acrylate ester monomer, when homopolymerized, has a Tg of less than about 10 DEG C; b) about 70 to about 30 parts by weight of a hydrophilic acidic comonomer; and c) about 10 to 100 parts based on 100 parts of the sum of components (a + b) of a non-reactive plasticizing agent, wherein the pressure sensitive adhesive adheres to wet substrate surfaces and a method of making.
摘要:
Compositions containing conductivity enhancers, which are capable of being coated onto a substrate by means of electrostatic assistance. The compositions comprise one or more free-radically curable monomer(s), and one or more non-volatile conductivity enhancer(s), having cationic and anionic portions, which are soluble in the monomer(s) and which do not interfere with free-radical polymerization, wherein said anionic portion is a non-coordinating organophilic carbon-containing anion. The compositions may further comprise one or more initiator(s), one or more dissociation enhancing agent(s), cross-linking agent(s), cationically polymerizable monomer(s), cationic initiator(s), leveling agents, oligomer(s) or polymer(s), preferably co-reactive, and other additives or adjuvants to impart specific properties to the cured coating.
摘要:
Cure-on-demand, moisture-curable compositions of one or more compounds comprising molecules having reactive silane functional groups and an acid generating material are taught herein. The acid generating material releases an acid upon exposure to heat, ultraviolet light, visible light, electron beam irradiation or microwave irradiation to initiate and accelerate the cross-linking reaction. Articles prepared using the moisture curable materials are also disclosed, as are methods of curing those materials.
摘要:
Free-radically polymerizable release coating compositions containing conductivity enhancers, which are capable of being electrosprayed onto a substrate. The compositions comprise (a) about 100 parts by weight of one or more free-radically polymerizable vinyl monomer(s), (b) from about 0.05 to about 250 parts by weight of one or more polydiorganosiloxane polymer(s) copolymerizable with the vinyl monomer(s), and (c) from about 0.10 to about 10 parts by weight, based on 100 parts by weight of (a) and (b), of one or more non-volatile conductivity enhancer(s), which are soluble in the monomer(s) and which do not interfere with polymerization, wherein the composition may be electrosprayed. The composition may further comprise from about 0.1 to about 5 parts by weight of one or more initiator(s) based on 100 parts by weight of monomer(s) and polydiorganosiloxane polymer(s). Another embodiment of the present invention further comprises at leas 0.1 part by weight, based on 100 parts by weight of monomer(s) and polydiorganosiloxane polymer(s), of one or more dissociation enhancing agent(s) soluble in the monomer(s).
摘要:
Non-tacky, base polymers are plasticized into pressure-sensitive adhesives and comprise: a) about 100 parts by weight of a base copolymer having a Tg greater than about 0 DEG C, wherein the base copolymer is formed from and comprises: (1) about 50 to 70% by weight of a high Tg comonomer component, wherein the homopolymer formed from the high Tg comonomer component has a Tg of at least about 20 DEG C; (2) optionally, up to about 20% by weight based on the total weight of the base copolymer of an acidic comonomer; and (3) about 30 to 50% by weight of one or more low Tg (meth)acrylate comonomer, wherein the Tg homopolymer of the low Tg comonomer is less than about 20 DEG C, and b) about 1 to about 100 parts based on the base copolymer of a non-reactive, non-volatile, non-acrylic-based plasticizing agent.
摘要:
Acrylate copolymer pressure sensitive adhesives (PSAs) which incorporate relatively small amounts of a plasticizer are disclosed. The resulting PSAs exhibit improved low temperature performance and minimal effect on other properties, when used as adhesives for graphic marking films. The adhesive system has been found to allow the graphic marking film to be applied at temperatures as low as 20 DEG F. (-7 DEG C.) and to improve the ability of the film to be applied to a substrate without trapping air between the marking film and the substrate. The adhesive system of the marking film also demonstrates resistance to tenting around the compound curved surfaces of rivet heads and corrugations typical of truck trailer sides.
摘要:
A mixture is provided comprising (a) at least one of an elastomeric thermoplastic, a non-elastomeric thermoplastic, an elastomeric thermoset and mixtures thereof, excluding polydiorganosiloxane fluids and (b) a polymer having soft polydiorganosiloxane units, hard polyisocyanate residue units, optionally, soft and/or hard organic polyamine residue units and terminal groups. The hard polyisocyanate residue and the hard polyamine residue comprise less than 50% by weight of the polydiorganosiloxane urea containing component. The polyisocyanate residue is the polyisocyanate minus the -NCO groups and the polyamine residue is the polyamine minus the -NH2 groups. The polyisocyanate residue is connected to the polyamine residue by urea linkages. The terminal groups are non-functional groups or functional groups. The polydiorganosiloxane urea containing component may be reactive under free-radical or moisture curing conditions. The mixture may also optionally contain tackifying materials, free radical initiators, crosslinking agents, cure catalysts, and nonreactive additives such as fillers, pigments, stabilizers, antioxidants, flame retardants, plasticizers, compatibilizers and the like.
摘要:
Ionically conductive adhesives are disclosed. The adhesives are prepared from zwitterionic polymers, preferably prepared from zwitterionic monomers. Medical devices, such as biomedical electrodes, skin coverings, and transdermal delivery devices using such adhesives so prepared are also disclosed.