公开(公告)号：EP0898326A2

公开(公告)日：1999-02-24

申请号：EP98115658.1

申请日：1998-08-20

Applicant: MOLEX INCORPORATED

Inventor： Fuerst, Robert M. ,  Hester, Todd A. ,  Krehbiel, Fred love

IPC: H01R9/07

CPC classification number: H01R13/7195 ,  H01R12/592 ,  H01R12/724 ,  H05K3/326

Abstract: A method of fabricating an electronic device (80), along with the product of that method is disclosed. A flat flexible dielectric substrate (68) is provided with a generally round hole (72) of a given diameter and with a ductile conductive film (70) on the substrate in an area at least about the hole. A generally round terminal pin (74) is provided with a given diameter greater than that of the hole. The difference between the diameter of the pin (74) and the diameter of the hole (72) is on the order of 5% to 50% of the diameter of the hole. At least a portion of the pin (74) is coated with a non-conductive adhesive (82). The pin (74) is inserted into the hole (72) in the substrate (68) such that the non-conductive adhesive (82) is scraped longitudinally from the pin to an area about the hole and the pin, leaving the pin (74) in contact with the conductive film (70).

Abstract translation: 在电子设备（80）的制造方法，非常久远方法的产品的方法所做的是游离缺失盘。 扁平软介质基片（68）在基片上在区域至少约孔设置有一个给定直径的基因反弹圆孔（72）和与可延展的导电膜（70）英寸 A基因反弹圆形端子销（74）设置有一个给定的直径比孔的直径。 所述销（74）和孔（72）的直径的直径之间的差异是的孔的直径的5％至50％的数量级上。 至少所述销（74）的一部分被涂覆有非导电性粘接剂（82）。 所述销（74）插入到（68）检测所做的非导电性粘合剂（82）基板上的孔（72）从所述销在大约孔和销区域纵向刮下，留下所述销（74 ）（在与导电膜70接触）。

公开(公告)号：EP0898326A3

公开(公告)日：1999-10-20

申请号：EP98115658.1

申请日：1998-08-20

Applicant: MOLEX INCORPORATED

Inventor： Fuerst, Robert M. ,  Hester, Todd A. ,  Krehbiel, Fred love

IPC: H01R9/07

CPC classification number: H01R13/7195 ,  H01R12/592 ,  H01R12/724 ,  H05K3/326

Abstract: A method of fabricating an electronic device (80), along with the product of that method is disclosed. A flat flexible dielectric substrate (68) is provided with a generally round hole (72) of a given diameter and with a ductile conductive film (70) on the substrate in an area at least about the hole. A generally round terminal pin (74) is provided with a given diameter greater than that of the hole. The difference between the diameter of the pin (74) and the diameter of the hole (72) is on the order of 5% to 50% of the diameter of the hole. At least a portion of the pin (74) is coated with a non-conductive adhesive (82). The pin (74) is inserted into the hole (72) in the substrate (68) such that the non-conductive adhesive (82) is scraped longitudinally from the pin to an area about the hole and the pin, leaving the pin (74) in contact with the conductive film (70).

公开(公告)号：EP0439256B1

公开(公告)日：1995-08-09

申请号：EP91300162.4

申请日：1991-01-10

Applicant: MOLEX INCORPORATED

Inventor： Arneson, Don A. ,  Hester, Todd A.

IPC: H01R4/04

CPC classification number: H01R4/04 ,  H05K1/118 ,  H05K1/182 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/321 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2203/1446 ,  Y02P70/611 ,  Y10T29/49153

公开(公告)号：EP0906005B1

公开(公告)日：2004-11-10

申请号：EP98117694.4

申请日：1998-09-15

Applicant: MOLEX INCORPORATED

Inventor： Berg, Paul Christopher ,  Etters, Harry N. ,  Fuerst, Robert M. ,  Hester, Todd A. ,  Krehbiel, Fred Love

IPC: H05K3/30 ,  H01R12/04 ,  H01R12/32

CPC classification number: H05K3/326 ,  H01R12/592 ,  H01R12/722

公开(公告)号：EP0793246B1

公开(公告)日：1999-06-02

申请号：EP97103021.8

申请日：1997-02-25

Applicant: MOLEX INCORPORATED

Inventor： Hester, Todd A. ,  Kreger, Daniel T.

IPC: H01H13/70

CPC classification number: H01H13/807 ,  H01H13/702 ,  H01H2225/01 ,  H01H2225/012

公开(公告)号：EP0906005A1

公开(公告)日：1999-03-31

申请号：EP98117694.4

申请日：1998-09-15

Applicant: MOLEX INCORPORATED

Inventor： Berg, Paul Christopher ,  Etters, Harry N. ,  Fuerst, Robert M. ,  Hester, Todd A. ,  Krehbiel, Fred Love

IPC: H05K3/30 ,  H01R9/07

CPC classification number: H05K3/326 ,  H01R12/592 ,  H01R12/722

Abstract: An electronic device (52) includes a flat flexible dielectric substrate (56) less than 0.050 inch thick and having a generally round hole (58) of a given diameter (66). A substantially square or polygonal terminal pin (62) is inserted into the round hole (58) in the substrate. The pin has a given cross-dimension (64) between opposite diametral corners thereof greater than the diameter of the round hole (58). The difference between the cross-dimension (64) of the pin (62) and the diameter (66) of the round hole (58) is on the order of 7% to 67% of the diameter of the hole.

Abstract translation: 电子设备（52）包括小于0.050英寸厚的扁平柔性电介质基板（56），并且具有给定直径（66）的大致圆形孔（58）。 将基本上为方形或多边形的端子销（62）插入到基板中的圆孔（58）中。 销在其相对的直径角之间具有大于圆孔（58）的直径的给定横向尺寸（64）。 销（62）的横向尺寸（64）和圆孔（58）的直径（66）之间的差值大约为孔直径的7％至67％。

公开(公告)号：EP0793246A1

公开(公告)日：1997-09-03

申请号：EP97103021.8

申请日：1997-02-25

Applicant: MOLEX INCORPORATED

Inventor： Hester, Todd A. ,  Kreger, Daniel T.

IPC: H01H13/70

CPC classification number: H01H13/807 ,  H01H13/702 ,  H01H2225/01 ,  H01H2225/012

Abstract: A normally closed electrical switch (10) includes a first circuit board (12) having a first switch contact (22) thereon and an aperture (26) therethrough near the first switch contact. A second, flexible circuit board (14) has a second switch contact (28) aligned with the first switch contact of the first circuit board. A spacer sheet (16) separates the first and second circuit boards (12,14) and has an aperture (38) in registry with the aperture in the first circuit board. The switch contacts (22,28) extend toward each other through the aperture (38) in the spacer sheet (16) such that they are in normally closed condition. A movable cover (18) is provided on the first circuit board at least over the aperture therein. An actuator (50) is operatively associated with the cover and extends through the aperture (26) in the first circuit board (12), through the aperture (38) in the spacer sheet (16) and engageable with the second, flexible circuit board (14) for flexing the second circuit board and opening the switch contacts (22,28) in response to movement of the cover.

Abstract translation: 常闭电气开关（10）包括其上具有第一开关触点（22）的第一电路板（12）和在第一开关触点附近通过的孔（26）。 第二柔性电路板（14）具有与第一电路板的第一开关触点对准的第二开关触点（28）。 间隔片（16）分离第一和第二电路板（12,14），并且具有与第一电路板中的孔对准的孔（38）。 开关触点（22,28）通过间隔片（16）中的孔（38）彼此延伸，使得它们处于常闭状态。 可移动盖（18）至少在其上的孔上设置在第一电路板上。 致动器（50）可操作地与盖相关联并且延伸穿过第一电路板（12）中的孔（26），穿过隔离片（16）中的孔（38）并与第二柔性电路板 （14），用于挠曲所述第二电路板并且响应于所述盖的移动而打开所述开关触点（22,28）。

公开(公告)号：EP0439256A1

公开(公告)日：1991-07-31

申请号：EP91300162.4

申请日：1991-01-10

Applicant: MOLEX INCORPORATED

Inventor： Arneson, Don A. ,  Hester, Todd A.

IPC: H01R4/04

CPC classification number: H01R4/04 ,  H05K1/118 ,  H05K1/182 ,  H05K3/0058 ,  H05K3/306 ,  H05K3/321 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/091 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2203/1446 ,  Y02P70/611 ,  Y10T29/49153

Abstract: An electronic device (10) which includes a circuit sheet (12) having a conductive path (14) thereon. An adhesive (18) is deposited on the conductive path (14), the adhesive (18) including a nonconductive base incorporating randomly spaced conducive particles (22). A circuit component (20) is forced through the adhesive (18), the conductive path (14) and the circuit sheet (12) carrying a portion of the adhesive (18) therewith between the circuit component (20) and the conductive path (14). The carried portion (30) of the adhesive (18) is compressed for establishing contact between the conductive particles (22) and thereby conductivity between the circuit component (20) and the conductive path (14) leaving the adhesive (18) other than that portion in a nonconductive state.

Abstract translation: 一种电子设备（10），其包括其上具有导电路径（14）的电路板（12）。 粘合剂（18）沉积在导电路径（14）上，粘合剂（18）包括具有随机间隔的导电颗粒（22）的非导电基底。 电路部件（20）被强制通过粘合剂（18），导电路径（14）和电路板（12）在电路部件（20）和导电路径（20）之间承载粘合剂（18）的一部分， 14）。 粘合剂（18）的承载部分（30）被压缩以建立导电颗粒（22）之间的接触，从而导致离开粘合剂（18）的电路部件（20）和导电路径（14）之间的电导率不同于该粘合剂 部分处于非导电状态。