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公开(公告)号：EP4190125A1
公开(公告)日：2023-06-07
申请号：EP21758876.3
申请日：2021-07-28
IPC分类号： H05B3/84 , H01R4/04 , H01R13/627 , H05B3/06
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公开(公告)号：EP3257109B1
公开(公告)日：2022-06-22
申请号：EP16749792.4
申请日：2016-02-10
发明人： PROKOPIAK, Steven, Dane , ARORA, Sanyogita , PANDHER, Ranjit, S. , TORMEY, Ellen, S. , SINGH, Bawa
IPC分类号： H01R4/04 , B23K35/00 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , B23K3/04 , B23K1/00 , B23K1/20 , C09J7/10 , B23K101/36 , B23K101/42
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公开(公告)号：EP3502557B1
公开(公告)日：2020-05-06
申请号：EP17210074.5
申请日：2017-12-22
申请人： ZKW Group GmbH
发明人： Gürtl, Josef , Hölzl, Andreas
IPC分类号： F21V21/35 , F21S41/19 , F21S41/155 , F21S43/19 , F21S43/145 , F21Y115/15 , H01R4/04
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公开(公告)号：EP3401928A1
公开(公告)日：2018-11-14
申请号：EP17170215.2
申请日：2017-05-09
申请人： Henkel AG & Co. KGaA
摘要： The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate and mixtures thereof; b) a reactive diluent; c) an electrically conductive filler; and d) a curing agent. The composition is particularly suitable for use in a solar cell and/or a photovoltaic module, especially in the photovoltaic module, wherein the solar cells are shingled.
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公开(公告)号：EP3357310A1
公开(公告)日：2018-08-08
申请号：EP16850439.7
申请日：2016-09-28
申请人： Tactotek Oy
发明人： HEIKKINEN, Mikko , RAAPPANA, Pasi , SÄÄSKI, Jarmo
IPC分类号： H05K5/00 , H05K3/28 , H01L23/538 , H05K5/06 , H01R12/77 , H01R12/61 , H05K1/03 , H05K1/14 , B32B27/08 , H01R4/04
CPC分类号： H05K3/4015 , H05K1/189 , H05K3/4046 , H05K2201/10287 , H05K2203/1327
摘要： A multilayer structure, includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, preferably printed on the first side for establishing a desired predetermined circuit design, plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a preferably flexible connector for providing external electrical connection to the embedded circuit on the first side from the second, opposite side, one end of the connector being attached to a predetermined contact area on the first side, the other end being located on the second side for coupling with an external element, the intermediate portion connecting the two ends being fed through an opening in the substrate, wherein the opening extending through the thickness of the film is dimensioned to accommodate the connector without substantial additional clearance.
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公开(公告)号：EP2840656B1
公开(公告)日：2018-08-08
申请号：EP12866399.4
申请日：2012-12-06
发明人： LING, Yan
CPC分类号： H05K7/026 , G02F1/13452 , H05K1/189 , H05K3/323 , H05K3/361 , H05K2201/10128 , H05K2201/10136 , Y10T29/49117
摘要： The present invention discloses, a connecting device, a flat panel device, an image sensor, a display and a touch apparatus are described. The connecting device for connecting a substrate unit and a chip unit, provided by the present invention, comprises a first flexible connection unit, including a first wire for electrically connecting to the substrate unit; a rigid connection unit, connected to the first flexible connection unit and including a second wire for electrically connecting to the first wire; the chip unit is electrically connected to the second wire. In the present invention, the chip unit is electrically connected to the substrate unit via the rigid connection unit and the flexible connection unit in sequence.
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公开(公告)号：EP2793239B1
公开(公告)日：2018-03-21
申请号：EP13305506.1
申请日：2013-04-18
申请人： Nexans
发明人： Dr. Steinberg, Helmut , Karchs, Roy
CPC分类号： H01B11/1808 , H01R4/04 , H01R4/64
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公开(公告)号：EP3240120A3
公开(公告)日：2018-01-24
申请号：EP17163681.4
申请日：2017-03-29
申请人： Deere & Company
发明人： ROAN, Thomas J , WIELAND, Andrew J , BRIJ, Singh N
IPC分类号： H01R13/66 , H01F3/00 , G01R31/36 , G01R15/20 , G01R19/00 , H01R4/30 , H05K1/02 , H05K1/03 , H05K1/11 , H05K1/18 , H01R4/02 , H01R4/04 , H01R4/34 , H01R12/53
CPC分类号： H05K1/0204 , G01R15/207 , G01R19/0092 , G01R31/382 , H01R4/023 , H01R4/04 , H01R4/183 , H01R4/304 , H01R4/34 , H01R12/53 , H01R13/6683 , H05K1/0346 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/181 , H05K1/189 , H05K2201/0154 , H05K2201/10151 , H05K2201/10318
摘要： An electrical connector assembly (10) includes a first electrically conductive contact member (12) and a second electrically conductive contact member (14). Both contact members have non-planar interface surfaces (20, 22). The second interface surface (22) is complimentary to the first interface surface (20). Magnetic field concentrators (702) are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier (704) comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor (706) is mounted on the flexible circuit carrier in the zone.
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公开(公告)号：EP3257109A1
公开(公告)日：2017-12-20
申请号：EP16749792.4
申请日：2016-02-10
发明人： PROKOPIAK, Steven, Dane , ARORA, Sanyogita , PANDHER, Ranjit, S. , TORMEY, Ellen, S. , SINGH, Bawa
CPC分类号： B23K1/0016 , B23K3/04 , B23K35/00 , B23K35/0238 , B23K35/0244 , B23K35/262 , B23K35/362 , B23K2201/36 , C09J7/10 , C09J2201/28 , C09J2203/326 , C09J2433/00 , C09J2463/00 , H01R4/04
摘要： A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
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公开(公告)号：EP2499704B1
公开(公告)日：2017-06-07
申请号：EP11719148.6
申请日：2011-03-01
发明人： FINK, Dieter , FINKE, Hans Michael
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