摘要:
A digital signal processing circuit (10) stores the peak value of the input signal on a storage element (26). The stored peak value is converted to a digital value (33). A ratio circuit forms a percentage value (36) that is a percent of the digital value (33). The percentage value (36) digitally stored and is used to form the threshold voltage (39). The threshold voltage (39) is compared to the input signal to produce an output (23).
摘要:
A differential charge and dump optoelectronic receiver for baseband digital optoelectronic data links is disclosed having a preamplifier and a voltage controlled current source that defines the tail current of a differential pair functioning as a two quadrant multiplier, and using capacitors as loads on the differential pair making said differential pair an integrator. The integrator provides a full differential output, part of which is fedback to control the gain of the preamplifier. In a preferred embodiment, one integrator pair is used to recover the data from a Manchester encoded data stream. In another preferred embodiment, two pairs of integrators are used for QPSK like codes.
摘要:
A method for molding optical waveguides (600) wherein one or more optical cores (230) are molded first with an attached support structure (206). A unitary cladding layer (601) is then molded around the cores (230) and the support structure (206) is removed to provide optical inlet/outlets to the cores (230). The ends of the cores (605) where the support structure (206) is removed may require subsequent polishing. The molding compound injected into mold (100) is made of an optically transparent material, such as polymers, epoxies, plastics, polyimides, or the like that is selected to be transparent to a desired wavelength of light. Generally, refractive indexes of these optically transparent materials range from 1.4 to 1.7. Processing conditions for these materials range from 22°C to 200°C for molding temperatures and 200 pounds per square inch to 2,000 pounds per square inch for molding pressures. By injecting the molding material, represented by arrow (204), into the plurality of cavities (101), intricacies of features (104) of mold (100) are transferred to the molding compound. A subsequent curing process solidifies the molding compound, thereby permanently transferring the intricacies or a negative image of the plurality of features (104) to the solidified molding compound, and thereby generating optical elements or core regions (230).
摘要:
An interconnect substrate (116) having a surface (105) with a plurality of electrical tracings (115) disposed thereon. A photonic device (114) having a working portion (118) and having a contact (106) electrically coupled to one of the plurality of electrical tracings (115) disposed on the interconnect substrate (116). A molded optical portion (112) that encapsulates the photonic device (114) is formed. The molded optical portion (112) forms a surface (120). The surface (120) passes light between the photonic device (114) and an optical fiber (103). Alignment of optical fiber 103 is achieved by an alignment apparatus (117) that is formed in the molded optical portion (112).
摘要:
A differential charge and dump optoelectronic receiver for baseband digital optoelectronic data links is disclosed having a preamplifier and a voltage controlled current source that defines the tail current of a differential pair functioning as a two quadrant multiplier, and using capacitors as loads on the differential pair making said differential pair an integrator. The integrator provides a full differential output, part of which is fedback to control the gain of the preamplifier. In a preferred embodiment, one integrator pair is used to recover the data from a Manchester encoded data stream. In another preferred embodiment, two pairs of integrators are used for QPSK like codes.
摘要:
An interconnect substrate (116) having a surface (105) with a plurality of electrical tracings (115) disposed thereon. A photonic device (114) having a working portion (118) and having a contact (106) electrically coupled to one of the plurality of electrical tracings (115) disposed on the interconnect substrate (116). A molded optical portion (112) that encapsulates the photonic device (114) is formed. The molded optical portion (112) forms a surface (120). The surface (120) passes light between the photonic device (114) and an optical fiber (103). Alignment of optical fiber 103 is achieved by an alignment apparatus (117) that is formed in the molded optical portion (112).
摘要:
A plurality of electrical traces (113) and a light emitting device (126) having a light emitting surface (127) is disposed on an interconnect substrate (112). A first optical part (135) having a first surface (137), a second surface (136), and a tapered surface (138) is disposed onto the interconnect substrate (112). The second surface (136) of the optical part (135) covers the working portion (127) of the light emitting device (126), a second surface (136) of the first optical part (135) is positioned parallel to the light emitting surface (127) of the light emitting device (126), and the tapered surface (138) extends from the second surface (136) toward the light emitting surface (127) of the light emitting device (126) for guiding light emitted from the light emitting surface (127) to the second surface (136).
摘要:
A molded optical waveguide (20) having electrical conductors (30) molded therein for contacting an optical device (50) mounted at one end (35) of the waveguide and providing external electrical access (38) to the optical device at exposed sides of the waveguide. The waveguide and assembled optical device is mounted on a printed circuit board or the like and contacted by lead wires.