摘要:
A radio frequency identification tag system (10) utilizes a radio frequency identification tag (16) that includes stored information. The tag includes an antenna element (28) and a common electrode (26), the common electrode being coupled to ground (70). The antenna element electrostatically receives an exciter signal (30) from a proximately-located exciter (12). Upon receiving the exciter signal, the tag becomes energized, thereby causing it to generate a read signal (32) based on the stored information. The antenna element then electrostatically sends the read signal to a proximately-located reader (14), which detects the stored information. Both energy and data are capacitively coupled by virtue of the unbalanced nature of the network, thus resulting in decreased coupled impedance.
摘要:
A radio frequency identification tag (100) includes a substrate member (110) having an inner surface and an outer surface. Disposed on the inner surface are first (112) and second (114) antenna elements. The antenna elements are electrically isolated from each other and coupled to two separate pads on an integrated circuit (116). Adhesive (118) is applied on the inner surface of the substrate, the antenna elements and the integrated circuit for securing the tag. The tag may employ an interposer (600) to attach integrated circuit (116) to the antenna elements (112, 114). The interposer (600) has a substrate (602) and first and second connecting pads (602, 604) electrically isolated from each other and electrically connected to the connecting pads on the integrated circuit (116). Interposer (600) reduces the amount of the precision required to successfully couple integrated circuit (116) to the antenna elements (112, 114).
摘要:
A radio frequency identification (RFID) tag (100), optimized for electrostatic applications, includes a first antenna element (112), a second antenna element (114) and an RFID circuit (116). The first antenna element is electrically isolated from the second antenna element. The RFID circuit has a first pad (230) and a second pad (232) with an input capacitance between them. The first and second pads of the RFID circuit are coupled, respectively, to the first and second antenna elements. The RFID circuit includes a load modulation circuit (222) coupled to at least one of the first or second pads to produce a load modulated signal on at least one of the first or second pads that varies from a first amplitude to a second amplitude. The load modulation circuit has a modulation impedance and a predetermined voltage threshold that an input signal must exceed before the modulated signal is produced.
摘要:
A radio frequency identification tag (100) includes a substrate member (110) having an inner surface and an outer surface. Disposed on the inner surface are first (112) and second (114) antenna elements. The antenna elements are electrically isolated from each other and coupled to two separate pads on an integrated circuit (116). Adhesive (118) is applied on the inner surface of the substrate, the antenna elements and the integrated circuit for securing the tag. The tag may employ an interposer (600) to attach integrated circuit (116) to the antenna elements (112, 114). The interposer (600) has a substrate (602) and first and second connecting pads (602, 604) electrically isolated from each other and electrically connected to the connecting pads on the integrated circuit (116). Interposer (600) reduces the amount of the precision required to successfully couple integrated circuit (116) to the antenna elements (112, 114).
摘要:
An RFID stamp (10) includes a substrate (24) with a first surface (12) and a second surface (18). The first surface (12) is printed with indicia indicating at least a postage value. An antenna (16) and an adhesive layer (22) are formed on the second surface (18) and an RFID circuit chip (20) is secured to the second surface (18) and coupled to the antenna (16). A mailing label (600) includes indicia (614) printed on a first surface, and an antenna (616) coupled to an RFID circuit chip (620) on a second surface (618). A layer (622) of adhesive covers the second surface. The layer bonds the circuit chip (620) to the second surface and couples the circuit chip (620) to the antenna (616). The circuit chip (620) retains sender information (601), recipient information (602), service type information (603) and billing instructions (604).