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公开(公告)号：EP4407679A3
公开(公告)日：2024-10-02
申请号：EP24154291.9
申请日：2024-01-26
发明人： CHAKRAVARTI, Aatreya , KUEMERLE, Mark William , SAUTER, Wolfgang , MACIAN RUIZ, Carlos , GREGORY, Jr. John Edward , HOLMES, Eva Shah , AKIKI, Samer Michael
IPC分类号： H01L25/065 , H01L25/18
CPC分类号： H01L25/0652 , H01L25/18 , H01L2225/0651320130101 , H01L2225/0651720130101 , H01L2225/065220130101 , H01L2225/0652420130101 , H01L2225/0652720130101 , H01L2225/0654120130101 , H01L2225/0654420130101 , H01L2225/0658620130101 , H01L25/50 , H01L24/17
摘要： An integrated circuit device includes a main integrated circuit die having functional circuitry configured to communicate over a network through one or more high-speed communications interfaces, and at least one secondary integrated circuit die including serial interface circuitry. Each integrated circuit die among the at least one secondary integrated circuit die is mounted on a first surface of the main integrated circuit die, and first metallization connections extend along one or more first through-silicon vias between the functional circuitry and the serial interface circuitry of the at least one secondary integrated circuit die. The first metallization connections may be configured to provide data from the main die to the secondary die, and the secondary die may be configured to communicate data between the integrated circuit device and a remote integrated circuit device. Second metallization connections extend between the serial interface circuitry of and terminals of the main integrated circuit die.
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公开(公告)号：EP4407679A2
公开(公告)日：2024-07-31
申请号：EP24154291.9
申请日：2024-01-26
发明人： CHAKRAVARTI, Aatreya , KUEMERLE, Mark William , SAUTER, Wolfgang , MACIAN RUIZ, Carlos , GREGORY, Jr. John Edward , HOLMES, Eva Shah , AKIKI, Samer Michael
IPC分类号： H01L25/065 , H01L25/18
CPC分类号： H01L25/0652 , H01L25/18 , H01L2225/0651320130101 , H01L2225/0651720130101 , H01L2225/065220130101 , H01L2225/0652420130101 , H01L2225/0652720130101 , H01L2225/0654120130101 , H01L2225/0654420130101 , H01L2225/0658620130101 , H01L25/50 , H01L24/17
摘要： An integrated circuit device includes a main integrated circuit die having functional circuitry configured to communicate over a network through one or more high-speed communications interfaces, and at least one secondary integrated circuit die including serial interface circuitry. Each integrated circuit die among the at least one secondary integrated circuit die is mounted on a first surface of the main integrated circuit die, and first metallization connections extend along one or more first through-silicon vias between the functional circuitry and the serial interface circuitry of the at least one secondary integrated circuit die. The first metallization connections may be configured to provide data from the main die to the secondary die, and the secondary die may be configured to communicate data between the integrated circuit device and a remote integrated circuit device. Second metallization connections extend between the serial interface circuitry of and terminals of the main integrated circuit die.
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