公开(公告)号：EP1480784A1

公开(公告)日：2004-12-01

申请号：EP03709418.2

申请日：2003-02-28

申请人： Micron Technology, Inc.

发明人： MOORE, Scott E. ,  LEE, Whonchee ,  MEIKLE, Scott G. ,  DOAN, Trung T.

IPC分类号： B24B37/04 ,  B24B49/10 ,  B23H5/08 ,  B23H5/10 ,  C25F7/00

CPC分类号： B24B37/042 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/10 ,  C25D5/06 ,  C25D5/18 ,  C25D5/22 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25D17/14 ,  C25F3/16 ,  C25F7/00 ,  H01L21/32125

摘要： Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configured to receive a microelectronic workpiece (110), a workpiece electrode (130), a first remote electrode (142a), and a second remote electrode (142b). The workpiece electrode (142) is configured to contact a processing side (113) of the workpiece (110) when the workpiece is received in the workpiece holder (120). The first and second remote electrodes (142) are spaced apart from the workpiece holder (120). The apparatus (100) can also include an AC power supply (174), a DC power supply (172), and a switching assembly (180). The switching assembly (180) is coupled to the workpiece electrode (130), the first remote electrode (142a), the second remote electrode (142b), the AC power supply (174), and the DC power supply (172). In operation, the switching assembly (180) couples the AC power supply (174) and/or the DC power supply (172) to the workpiece electrode (130), the first remote electrode (142a), and/or the second remote electrode (142b) for plating, deplating and/or mechanically removing material.

公开(公告)号：EP1399956A2

公开(公告)日：2004-03-24

申请号：EP02744464.5

申请日：2002-06-20

申请人： Micron Technology, Inc.

发明人： LEE, Whonchee ,  MEIKLE, Scott G. ,  MOORE, Scott E. ,  DOAN, Trung T.

IPC分类号： H01L21/321 ,  B24B37/04

CPC分类号： B24B37/046 ,  C25F3/30 ,  C25F5/00 ,  C25F7/00 ,  H01L21/32125

摘要： A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad,electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential,and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate, disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid, and movingat least one of the microelectronic and the polishing pad relative to the other.