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公开(公告)号：EP4012075A1
公开(公告)日：2022-06-15
申请号：EP20852948.7
申请日：2020-08-03
Applicant: Mitsubishi Materials Corporation
Inventor： TARUTANI, Yoshie , KUBOTA, Kenji
Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 µm to 20 µm inclusive, a nickel content of 0.03 at% to 1.20 at% inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
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公开(公告)号：EP4186999A1
公开(公告)日：2023-05-31
申请号：EP21847175.3
申请日：2021-02-24
Applicant: Mitsubishi Materials Corporation
Inventor： TARUTANI, Yoshie , KATOU, Naoki , KUBOTA, Kenji
Abstract: A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 µm or more and 20.0 µm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.
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公开(公告)号：EP4108811A1
公开(公告)日：2022-12-28
申请号：EP21757568.7
申请日：2021-01-28
Applicant: Mitsubishi Materials Corporation
Inventor： TARUTANI, Yoshie , KUBOTA, Kenji , KATOU, Naoki
Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
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公开(公告)号：EP3660190A1
公开(公告)日：2020-06-03
申请号：EP18837271.8
申请日：2018-07-26
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TARUTANI, Yoshie , TAMAGAWA, Takashi , NAKAYA, Kiyotaka
Abstract: Providing a tin-plated terminal material with high corrosion-prevention effect and low contact resistance, a terminal formed from the terminal material, and an electric wire terminal-end structure using the terminal.
Provided are a base material 2 made of copper or copper alloy, a zinc layer 4 made of zinc or zinc alloy formed on the base material 2, and a tin layer 5 made of tin or tin alloy formed on the zinc layer 4: in a whole of the zinc layer 4 and the tin layer 5, a tin amount per unit area is 0.30 mg/cm 2 to 7.00 mg/cm 2 inclusive, a zinc amount per unit area is 0.07 mg/cm 2 to 2.00 mg/cm 2 inclusive, a content percentage of zinc in a vicinity of a surface in the tin layer 5 is 0.2% to 10% by mass inclusive, and a length proportion of low-angle grain boundaries occupied in a total length of crystal boundaries in the tin layer 5 is 2% to 30% inclusive.-
公开(公告)号：EP3904564A1
公开(公告)日：2021-11-03
申请号：EP19901658.5
申请日：2019-12-27
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TAMAGAWA, Takashi , NISHIMURA, Toru , TARUTANI, Yoshie , NAKAYA, Kiyotaka
Abstract: Providing an anti-corrosion terminal material having high corrosion resistance effect and good adhesiveness of a film.
A first film is formed on at least a part of a base material in which at least a surface is made of copper or copper alloy; in the first film, a zinc layer made of zinc or zinc alloy is formed on a mixed layer in which a copper-tin alloy region made of copper tin alloy and a tin region made of tin or tin alloy other than copper tin alloy are mixed; the zinc layer is in contact with both the copper-tin alloy region and the tin region of the mixed layer; a ratio R1/R2 is 0.05 or more and 2.5 or less where a length in contact with the copper-tin alloy region in a cross section along a thickness direction is R1 (µm) and a length in contact with the tin layer is R2 (µm).-
Patent Agency Ranking6.发明公开
公开(公告)号：EP3705606A1
公开(公告)日：2020-09-09
申请号：EP18872594.9
申请日：2018-10-25
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TARUTANI, Yoshie , TAMAGAWA, Takashi , NAKAYA, Kiyotaka
Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part in which a core of an electric wire is in contact with when a terminal is formed; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 µm and not more than 5.0 µm and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.
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7.发明公开Tin-plated copper-alloy material for terminal having excellent insertion/extraction performance 审中-公开Verzinntes Kupferlegierung物质
公开(公告)号：EP2784190A1
公开(公告)日：2014-10-01
申请号：EP14160700.2
申请日：2014-03-19
Applicant: Mitsubishi Materials Corporation
Inventor： KATO, Naoki , INOUE, Yuki , TARUTANI, Yoshie
IPC: C25D5/00
CPC classification number: H01B1/026 , C25D3/30 , C25D3/38 , C25D5/10 , C25D5/34 , C25D5/505 , Y10T428/12715
Abstract: To provide tin-plated copper-alloy material for terminal having an excellent insertion/extraction performance by reducing dynamic friction coefficient to 0.3 or less with bringing out an excellent electrical-connection characteristic.
Tin-plated copper-alloy terminal material in which an Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a Cu-Sn alloy layer is formed between the Sn-based surface layer and the substrate; the Cu-Sn alloy layer contains Cu 6 Sn 5 as a major proportion and has a compound in which a part of Cu in the Cu 6 Sn 5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an arithmetic average roughness Ra of the Cu-Sn alloy layer is 0.3 µm or more in at least one direction and an arithmetic average roughness Ra in all direction is 1.0 µm or less; an oil-sump depth Rvk of the Cu-Sn alloy layer is 0.5 µm or more; and an average thickness of the Sn-based surface layer is 0.4 µm or more and 1.0 µm or less and dynamic friction coefficient is 0.3 or less.Abstract translation: 通过将动摩擦系数降低到0.3以下，提供优异的电连接特性，提供具有优异插入/拔出性能的用于端子的镀锡铜合金材料。 在Cu基合金制的基板的表面上形成有Sn系的表面层和在Sn系表面层与基板之间形成Cu-Sn合金层的镀锡铜合金端子材料， Cu-Sn合金层含有主要比例的Cu 6 Sn 5，并且在基板侧的边界面附近具有Cu 6 Sn 5中的Cu的一部分被Ni和Si取代的化合物; Cu-Sn合金层的算术平均粗糙度Ra在至少一个方向上为0.3μm以上，并且所有方向的算术平均粗糙度Ra为1.0μm以下; Cu-Sn合金层的油槽深度Rvk为0.5μm以上; Sn系表面层的平均厚度为0.4μm以上且1.0μm以下，动摩擦系数为0.3以下。
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8.发明公开
公开(公告)号：EP3595094A1
公开(公告)日：2020-01-15
申请号：EP18763484.5
申请日：2018-03-06
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TARUTANI, Yoshie , NAKAYA, Kiyotaka
IPC: H01R13/03 , C23F15/00 , C25D5/10 , C25D5/12 , C25D7/00 , H01B7/00 , H01B7/28 , H01R4/18 , H01R4/62
Abstract: To providing a corrosion-resistant terminal material with which galvanic corrosion does not arise easily by using a copper or copper alloy base material as a terminal to which an end of wire having an aluminum core wire is crimped, and a corrosion-resistant terminal using that terminal material.
Corrosion-resistant terminal material has a substrate made of copper or a copper alloy and a film layered on the substrate, the corrosion-terminal material is formed to have a planned core wire contact part with which a core wire of an electric wire is in contact when the material is formed to a terminal and a planned contact part to be a contact part: the film formed in the planned core wire contact part has a tin layer made of tin or tin alloy and a metallic zinc layer formed on the tin layer; the film formed in the planned contact part has a tin layer made of tin or tin alloy but does not have a metallic zinc layer.-
公开(公告)号：EP3456871A1
公开(公告)日：2019-03-20
申请号：EP17796129.9
申请日：2017-05-09
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TARUTANI, Yoshie , NAKAYA, Kiyotaka
Abstract: A terminal material in which galvanic corrosion is not occurred using a copper or copper alloy base material as a terminal crimped to an end part of an electrical wire formed from an aluminum wire material: an intermediate zinc layer 4 formed from zinc or zinc alloy and a tin layer 5 formed from tin or tin alloy are layered in this order on a base material 2 formed from copper or copper alloy; the intermediate zinc layer 4 has a thickness of 0.1 µm to 5.0 µm inclusive and a zinc concentration equal to or more than 5 mass%; and the tin layer 5 has a zinc concentration of 0.4 mass% to 15 mass% inclusive and a grain size of the tin layer 5 is 0.1 µm to 3.0 µm inclusive preferably.
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公开(公告)号：EP3382814A1
公开(公告)日：2018-10-03
申请号：EP16868581.6
申请日：2016-11-24
Applicant: Mitsubishi Materials Corporation
Inventor： KUBOTA, Kenji , TARUTANI, Yoshie , NAKAYA, Kiyotaka
CPC classification number: C22C18/00 , C22C19/03 , C25D5/10 , C25D5/50 , C25D7/00 , H01R4/62 , H01R13/03
Abstract: On a base member 2 made of copper or a copper alloy, a zinc-nickel alloy layer 4 including zinc and nickel, and a tin layer 5 made of tin alloy are laminated in this order: the zinc-nickel alloy layer 4 has a thickness of 0.1-5 µm inclusive and has a nickel content of 5-50 mass% inclusive, the tin layer 5 has a zinc concentration of 0.6-15 mass% inclusive, and, under an oxide layer 6 which is the outermost layer, a metal zinc layer 7, having a zinc concentration of 5-40 at% inclusive and a thickness of 1-10 nm inclusive in SiO 2 conversion, is formed on the tin layer 5.
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