公开(公告)号：EP4131348A1

公开(公告)日：2023-02-08

申请号：EP21780655.3

申请日：2021-03-05

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  KURIHARA, Hiroyoshi

IPC分类号： H01L21/56

摘要： A method for manufacturing an electronic device, the method including at least a preparing step of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and used for temporarily fixing an electronic component (70), an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10), and an unevenness-absorbing resin layer (C) provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), and which is able to be cross-linked by an external stimulus, and an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50) and having an uneven structure (75), a cross-linking step of cross-linking the unevenness-absorbing resin layer (C) by applying an external stimulus to the unevenness-absorbing resin layer (C) in the structure (100), and a sealing step of sealing the electronic component (70) with a sealing material (60).

公开(公告)号：EP3778816A1

公开(公告)日：2021-02-17

申请号：EP19777770.9

申请日：2019-03-19

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： IGARASHI, Kouji ,  KINOSHITA, Jin ,  KURIHARA, Hiroyoshi ,  MIURA, Toru

IPC分类号： C09J7/38 ,  C09J11/00 ,  C09J133/04 ,  C09J201/00 ,  H01L21/56

摘要： An adhesive film (50) of the present invention includes a base material layer (10); an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10); and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F 2.5 ) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130°C, and an integrated tacking force value (F 30 ) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130°C.
(method 1) using a tacking tester, a probe is pressed on the adhesive resin layer (B) for 60 seconds under conditions of a probe load of 100 gf and a probe pushing speed of 120 mm/min, then, at a test temperature of 130°C, tack strengths (gf) are respectively measured at test speeds of 2.5 mm/min and 30 mm/min, a measurement time is set as a horizontal axis and the tack strength (gf) is set as a vertical axis, integrated values are each calculated from a point where the tack strength starts to rise from 0 to a point where the tack strength becomes 0 again, and the calculated values are respectively set as F 2.5 and F 30 .

公开(公告)号：EP3978577A1

公开(公告)日：2022-04-06

申请号：EP20817947.3

申请日：2020-05-13

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  KURIHARA, Hiroyoshi

IPC分类号： C09J5/06 ,  C09J133/00 ,  C09J201/00 ,  H01L21/56 ,  C09J7/24 ,  C09J7/25 ,  C09J7/38

摘要： A method for manufacturing an electronic device includes at least a step (1) of preparing a structure (100) comprising (i) an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is reduced by an external stimulus, in which a storage modulus E' at 125°C of the adhesive resin layer (A) is 0.2×10 6 Pa or more and 4.5×10 6 Pa or less, (ii) an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50), and (iii) a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50); a step (2) of sealing the electronic component (70) with a sealing material (60); a step (3) of peeling the support substrate (80) from the structure (100) by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film (50) from the electronic component (70).

公开(公告)号：EP3940765A1

公开(公告)日：2022-01-19

申请号：EP20769648.5

申请日：2020-02-27

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  KURIHARA, Hiroyoshi

IPC分类号： H01L23/12 ,  C09J123/00 ,  C09J125/04 ,  C09J133/00 ,  C09J175/04 ,  C09J183/04 ,  H01L21/56 ,  C09J7/38

摘要： A method for manufacturing an electronic device includes at least a preparing step of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and used for temporarily fixing an electronic component (70), an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50) and having an uneven structure (75), and a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50) ; and a sealing step of sealing the electronic component (70) with a sealing material (60).

公开(公告)号：EP3940764A1

公开(公告)日：2022-01-19

申请号：EP20769186.6

申请日：2020-02-27

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  KURIHARA, Hiroyoshi

IPC分类号： H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  C09J123/00 ,  C09J125/04 ,  C09J133/00 ,  C09J175/04 ,  C09J183/04 ,  H01L21/56 ,  C09J7/38

摘要： A method for manufacturing an electronic device includes at least a preparing step of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and used for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is reduced by external stimuli, an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50), a pre-baking step of heating the structure (100), and a sealing step of sealing the electronic component (70) with a sealing material (60).

公开(公告)号：EP3780072A1

公开(公告)日：2021-02-17

申请号：EP19775431.0

申请日：2019-03-19

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： IGARASHI, Kouji ,  KINOSHITA, Jin ,  KURIHARA, Hiroyoshi ,  MIURA, Toru

IPC分类号： H01L21/56 ,  C09J7/38 ,  C09J133/00 ,  C09K3/10

摘要： The method for manufacturing an electronic device of the present invention includes at least: a step (1) of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and in which an adhesive force is decreased by an external stimulus, an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) attached to the adhesive resin layer (B) of the adhesive film (50) ; at least one step (2) selected from a step (2-1) of decreasing water content in the adhesive film (50) and a step (2-2) of decreasing water content in the structure (100); and a step (3) of sealing the electronic component (70) with a sealing material (60).

公开(公告)号：EP3862403A1

公开(公告)日：2021-08-11

申请号：EP19869448.1

申请日：2019-09-20

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  IGARASHI, Kouji ,  KURIHARA, Hiroyoshi

IPC分类号： C09J7/38 ,  B32B27/00 ,  C09J7/25 ,  C09J11/00 ,  C09J133/00 ,  C09J201/00 ,  H01L21/56

摘要： An adhesive film (50) of the present invention includes a base material layer (10), an adhesive resin layer (A) which is provided on a first surface (10A) side of the base material layer (10), and an adhesive resin layer (B) which is provided on a second surface (10B) side of the base material layer (10) and of which an adhesive force is decreased by an external stimulus, in which, a shrinkage rate of the film in a direction that the heat shrinkage is maximum is 0.0% or more and 0.40% or less as measured under conditions of heating at 150°C for 30 minutes in accordance with JIS C2151.