公开(公告)号：EP4180176A1

公开(公告)日：2023-05-17

申请号：EP21837337.1

申请日：2021-07-07

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： HAYASHISHITA, Eiji

IPC分类号： B24B7/22 ,  C09J201/00 ,  B24B41/06 ,  H01L21/304 ,  C09J7/29 ,  C09J7/38

摘要： Provided are a protective film and a back grinding method for a semiconductor wafer, which can suppress occurrence of suction defect. A protective film 30 is a film that protects a surface 11 of a semiconductor wafer 10 on which a circuit is formed when a back surface 12 of the semiconductor wafer 10 is ground in a state where the surface 11 of the semiconductor wafer 10 is sucked to a fixture 41. The protective film 30 has a pressure-sensitive adhesive layer 33, a base material layer 31, and an auxiliary layer 32. The pressure-sensitive adhesive layer 33 is a layer to be stuck to the semiconductor wafer 10, the auxiliary layer 32 is a layer to be contact to the fixture 41, and the semiconductor wafer 10 is a semiconductor wafer having a level difference 13 on an outer peripheral edge of the surface 11 on which the circuit is formed.

公开(公告)号：EP4131348A1

公开(公告)日：2023-02-08

申请号：EP21780655.3

申请日：2021-03-05

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MIURA, Toru ,  KURIHARA, Hiroyoshi

IPC分类号： H01L21/56

摘要： A method for manufacturing an electronic device, the method including at least a preparing step of preparing a structure (100) provided with an adhesive film (50) provided with a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10) and used for temporarily fixing an electronic component (70), an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10), and an unevenness-absorbing resin layer (C) provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), and which is able to be cross-linked by an external stimulus, and an electronic component (70) attached to the adhesive resin layer (A) of the adhesive film (50) and having an uneven structure (75), a cross-linking step of cross-linking the unevenness-absorbing resin layer (C) by applying an external stimulus to the unevenness-absorbing resin layer (C) in the structure (100), and a sealing step of sealing the electronic component (70) with a sealing material (60).

公开(公告)号：EP3950226A1

公开(公告)日：2022-02-09

申请号：EP20781959.0

申请日：2020-03-18

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： HAYASHISHITA Eiji

IPC分类号： B24B27/06 ,  H01L21/301

摘要： A method for manufacturing an electronic device includes a step (A) of preparing a structure (100) provided with an electronic component (70) and an adhesive film (50) attached to the electronic component (70), and a step (B) of dicing the electronic component (70) with a dicing blade in a state of being attached to the adhesive film (50), in which the adhesive film (50) is provided with a base material layer (10), an intermediate layer (20), and an adhesive resin layer (30) in this order, and when a thickness of the base material layer (10) is X 1 and a thickness of the intermediate layer (20) is X 2 , a relationship of X 2 > X 1 is satisfied.

公开(公告)号：EP3778817A1

公开(公告)日：2021-02-17

申请号：EP19778293.1

申请日：2019-03-19

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： IGARASHI Kouji ,  KINOSHITA Jin ,  KURIHARA Hiroyoshi ,  MIURA Toru

IPC分类号： C09J7/38 ,  C09J11/00 ,  C09J133/00 ,  C09J201/00 ,  H01L21/56

摘要： An adhesive film (50) of the present invention includes a base material layer (10) ; an adhesive resin layer (A) provided over a first surface (10A) side of the base material layer (10); and an adhesive resin layer (B) provided over a second surface (10B) side of the base material layer (10) and in which an adhesive force is decreased by an external stimulus, in which, the adhesive resin layer (B) side is attached to a stainless steel plate, then, a slide glass was mounted and adhered on the adhesive resin layer (A) side, then, a heat treatment was performed at 130°C for 30 minutes, then, when, in a vacuum oven, pressure is reduced inside the vacuum oven at 125°C and an exhaust rate of 120 L/min, floating of the adhesive film (50) from the stainless steel plate is not observed until the pressure in the vacuum oven reaches 100 Pa.

公开(公告)号：EP3657532A1

公开(公告)日：2020-05-27

申请号：EP18835150.6

申请日：2018-07-09

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： UNEZAKI Takashi ,  KAMADA Jun ,  MORIMOTO Akimitsu ,  KINOSHITA Jin

IPC分类号： H01L21/301 ,  H01L23/00 ,  H05K9/00

摘要： Provided is a method of producing an electronic device, including a step (A) of preparing a structure (60) which includes an electronic component (10) having a circuit forming surface (10A), and an adhesive laminated film (50) which includes a base material layer (20), an unevenness-absorptive resin layer (30), and an adhesive resin layer (40) in this order and in which the adhesive resin layer (40) is attached to the circuit forming surface (10A) of the electronic component (10) such that the circuit forming surface (10A) is protected; and a step (B) of forming an electromagnetic wave-shielding layer (70) on the electronic component (10) in a state of being attached to the adhesive laminated film (50).

公开(公告)号：EP3546540A1

公开(公告)日：2019-10-02

申请号：EP17873047.9

申请日：2017-11-16

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： HAYASHISHITA, Eiji

IPC分类号： C09J7/20 ,  C09J133/06 ,  B32B27/00 ,  H01L21/301

摘要： An adhesive laminate film (50) of the present invention has a heat-resistant resin layer (10), a flexible resin layer (20), and an adhesive resin layer (30) in this order, a peel strength P 0 between the heat-resistant resin layer (10) and the flexible resin layer (20), which is based on JIS Z0237 and measured using a method described below, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P 1 between the heat-resistant resin layer (10) and the flexible resin layer (20) after a thermal treatment of the adhesive laminate film (50) at 160°C for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm,
(method for measuring peel strength) the adhesive laminate film (50) is attached to a silicon wafer so that the adhesive resin layer (30) comes into contact with the silicon wafer. Next, the heat-resistant resin layer (10) is peeled off from the flexible resin layer (20) using a tensile tester in a 180-degree direction under conditions of 25°C and a tensile rate of 300 mm/minute, a strength (N/25 mm) at this time is measured twice, and an average value is regarded as the peel strength.

公开(公告)号：EP3533850A1

公开(公告)日：2019-09-04

申请号：EP17863464.8

申请日：2017-10-24

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： HAYASHISHITA Eiji

IPC分类号： C09J7/20 ,  G01R31/26 ,  H01L21/301 ,  H01L21/66

摘要： A method for manufacturing electronic apparatus of the present invention includes: a step (A) of preparing a structure (100) provided with an adhesive film (50) and one or two or more electronic components (70) affixed to an adhesive surface of the adhesive film (50); a step (B) of disposing the structure (100) in the electronic component testing apparatus (200) such that the electronic component (70) is positioned over an electronic component installation region (85) of a sample stand (80) of the electronic component testing apparatus (200) with the adhesive film (50) interposed between the electronic component (70) and the electronic component installation region (85), the electronic component testing apparatus (200) being provided with the sample stand (80) including the electronic component installation region (85) and a probe card (90) that is provided at a position facing the sample stand (80) and includes a probe terminal (95); a step (C) of evaluating the properties of the electronic component (70) in a state of being affixed to the adhesive film (50) with the probe terminal (95) being in contact with a terminal (75) of the electronic component (70); and a step (D) of picking up the electronic component (70) from the adhesive film (50) after the step (C). In addition, at least in the step (C), the structure (100) is disposed within a frame (150), an end portion (55) of the adhesive film (50) is fixed to the frame (150), and an upper surface (155) of the frame (150) is disposed below an upper surface (88) of the electronic component installation region (85) of the sample stand (80) in a perpendicular direction X of the sample stand (80).

公开(公告)号：EP3333220A1

公开(公告)日：2018-06-13

申请号：EP16835044.5

申请日：2016-08-03

申请人： Mitsui Chemicals Tohcello, Inc.

发明人： MUROFUSHI Takanobu ,  TOKUHIRO Jun ,  IKENAGA Shigenobu

IPC分类号： C08L23/04 ,  B32B27/32

CPC分类号： C08L23/08 ,  B32B15/085 ,  B32B27/08 ,  B32B27/32 ,  B32B2323/04 ,  C08J5/18 ,  C08J2323/08 ,  C08L23/04 ,  C08L23/0853 ,  C08L2312/00

摘要： A photo-crosslinkable ethylene-based resin composition of the present invention includes an ethylene-based copolymer having a Shore A hardness measured in accordance with ASTM D2240 of equal to or more than 55 and equal to or less than 95, a photo-crosslinking initiator, and a crosslinking aid, in which the content of the crosslinking aid is equal to or more than 0.1 parts by mass and less than 2.0 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.

公开(公告)号：EP3202568A4

公开(公告)日：2018-05-23

申请号：EP15846393

申请日：2015-09-29

申请人： MITSUI CHEMICALS TOHCELLO INC

发明人： MATOBA DAISUKE ,  KIDOKORO MASAKO ,  NOMOTO AKIRA ,  SHIMAKAGE AIKO

IPC分类号： C08J7/04 ,  A61J1/10 ,  B65D65/40 ,  B65D77/04 ,  C08J7/06

CPC分类号： B65D65/40 ,  A61J1/00 ,  A61J1/10 ,  B32B9/005 ,  B32B27/06 ,  B32B2439/80 ,  B65D77/04 ,  C08J7/045 ,  C08J7/06 ,  C08J2323/08 ,  C08J2367/02 ,  C08J2427/08 ,  C08J2429/04 ,  C08J2433/02 ,  C08J2475/04

摘要： A laminate film (100) of the present invention includes a substrate layer (101) ; and a metal oxide layer (103) which is provided on one surface or both surfaces of the substrate layer (101) and contains a metal oxide. Further, the oxygen permeability measured under conditions of a temperature of 20°C and a humidity of 90% RH in conformity with JIS K 7126-2:2006 is 20 ml/m 2 ·day·MPa or less and the water vapor permeability measured under conditions of a temperature of 40°C and a humidity of 90% RH is 2.5 g/m 2 day or greater. In addition, when the K± beam intensity of a metal constituting the metal oxide which is obtained by performing fluorescence X-ray analysis on the metal oxide layer (103) is set to A and the K± beam intensity of the metal which is obtained by performing fluorescence X-ray analysis on a metal layer formed of the metal constituting the metal oxide is set to B, A/B is equal to or greater than 0.20 and equal to or less than 0.97.

公开(公告)号：EP2833415B1

公开(公告)日：2018-05-02

申请号：EP13767543.5

申请日：2013-03-13

申请人： Mitsui Chemicals, Inc. ,  Mitsui Chemicals Tohcello, Inc.

发明人： IKENAGA, Shigenobu ,  TAKEUCHI, Fumito ,  ITO, Tomoaki

IPC分类号： H01L31/048 ,  C08L23/08

CPC分类号： H01L31/0203 ,  C08F210/16 ,  C08L23/0807 ,  C08L23/16 ,  C08L2203/204 ,  C08L2203/206 ,  H01L31/0481 ,  Y02E10/50

摘要： An encapsulating material for solar cell of the invention contains an ethylene/±-olefin copolymer, and a content of a fluorine element in the ethylene/±-olefin copolymer, which is determined using a combustion method and an ion chromatograph method, is equal to or less than 30 ppm.