公开(公告)号：EP2190014A1

公开(公告)日：2010-05-26

申请号：EP08830793.9

申请日：2008-09-12

申请人： Mitsui Mining & Smelting Co., Ltd ,  Sun-a Corporation

发明人： NAKAMURA, Toshimi ,  KAWANISHI, Toshiaki ,  HOSOI, Toshihiro ,  IZUTANI, Kenjiro ,  NAKAMURA, Hiroyuki ,  OSAWA, Yutaka ,  SUNADA, Hiroaki ,  TAKAHASHI, Tetsuyasu

IPC分类号： H01L23/50

CPC分类号： H01L23/49582 ,  G01L19/0084 ,  G01L19/141 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： [Problem] It is an object to provide a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected.
[Means for Resolution] A lead frame comprises an outer lead part and an inner lead part, and a plating is carried out to at least a part of at least any one of the outer lead part and the inner lead part.

摘要翻译： 本发明的目的是提供一种引线框架，具有引线框架的电子设备，引线框架的制造方法以及具有通过该方法制造的引线框架的电子设备的制造方法 制造引线框架不被腐蚀的引线框架，引线框架的机械强度不降低，不需要执行由两个阶段组成的常规电镀处理步骤，工艺简单，成本 较低，并且不产生大量的诸如电镀处理液体的废液，从而防止环境的影响。 [解决方法]引线框架包括外引线部分和内引线部分，并且对外引线部分和内引线部分中的至少一个的至少一部分进行电镀。