公开(公告)号：EP2660862B1

公开(公告)日：2018-12-26

申请号：EP13164228.2

申请日：2013-04-18

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives

发明人： Souriau, Jean-Charles ,  Castagne, Leaticia ,  Parat, Guy-Michel

IPC分类号： H01L23/66 ,  G06K19/07

CPC分类号： H01Q19/10 ,  G06K19/07786 ,  H01L21/50 ,  H01L22/10 ,  H01L23/10 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L25/165 ,  H01L2223/6677 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/81424 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81484 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85466 ,  H01L2224/85484 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/16586 ,  H01L2924/167 ,  H01Q1/38 ,  H04B1/3888 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP3410470A1

公开(公告)日：2018-12-05

申请号：EP18182981.3

申请日：2006-03-20

申请人： Micron Technology, Inc.

发明人： HEMBREE, David R.

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  B23K20/00 ,  H05K3/40

CPC分类号： H01L25/0657 ,  B23K20/004 ,  B23K20/005 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/8121 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/53213 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for fabricating a semiconductor component (86) with a through wire interconnect (102) includes the step of providing a substrate (54) having a circuit side (62), a back side (64), and a through via (76). The method also includes the steps of: threading a wire (14) through the via (76), forming a contact (90) on the wire (14) on the back side (64), forming a bonded contact (92) on the wire (14) on the circuit side (62), and then severing the wire (14) from the bonded contact (92). The through wire interconnect includes (102) the wire (14) in the via (76), the contact (90) on the back side (64) and the bonded contact (92) on the circuit side (62). The contact (90) on the back side (64), and the bonded contact (92) on the circuit side (62), permit multiple components (86-1, 86-2, 86-3) to be stacked with electrical connections (170) between adjacent components. A system (120) for performing the method includes the substrate (54) with the via (76), and a wire bonder (10) having a bonding capillary (12) configured to thread the wire (14) through the via (76), and form the contact (90) and the bonded contact (92). The semiconductor component (86) can be used to form chip scale components, wafer scale components, stacked components (146), or interconnect components (861) for electrically engaging or testing other semiconductor components (156).

公开(公告)号：EP3408864A1

公开(公告)日：2018-12-05

申请号：EP17744701.8

申请日：2017-01-18

申请人： Kulicke and Soffa Industries, Inc.

发明人： DEANGELIS, Dominick, A.

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/48

CPC分类号： B23K20/106 ,  B23K20/004 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/78252 ,  H01L2224/78319 ,  H01L2224/78349 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099

摘要： A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

公开(公告)号：EP3396858A1

公开(公告)日：2018-10-31

申请号：EP18169400.1

申请日：2018-04-26

申请人： NXP USA, Inc.

发明人： QUI, Xiaofei ,  PIEL, Pierre Marie ,  MONGIN, Lionel

IPC分类号： H03F1/56 ,  H01L23/00 ,  H01P5/18 ,  H03F3/195

CPC分类号： H05B6/6467 ,  G01R21/12 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/49175 ,  H01P5/185 ,  H03F1/565 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H03F2200/465 ,  H03F2203/21139 ,  H03F2203/21163 ,  H03H7/38 ,  H05B6/68 ,  H05B6/681 ,  H01L2924/00014 ,  H01L2924/20755

摘要： A device includes an output circuit that includes an input port at which a signal is received, an output port at which an impedance-adjusted representation of the signal is provided, and a set of bond wires connecting the input and output ports. The device further includes first and second couplers, each including a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires. The first coupler is oriented relative to the distributed-element output circuit to measure forward power provided by the impedance-adjusted representation of the signal via the output port. The second coupler is oriented relative to the output circuit to measure reflected power received via the output port.

公开(公告)号：EP1889290B1

公开(公告)日：2018-09-19

申请号：EP06760290.4

申请日：2006-05-23

申请人： Texas Instruments Incorporated

发明人： LANGE, Bernhard

IPC分类号： H01L23/36 ,  H01L21/58 ,  H01L23/495

CPC分类号： H01L23/36 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils.

公开(公告)号：EP3351910A3

公开(公告)日：2018-09-05

申请号：EP18152501.5

申请日：2008-10-29

申请人： VEGA Grieshaber KG

发明人： SCHULTHEISS, Daniel ,  FISCHER, Michael

IPC分类号： G01F23/284 ,  G01S13/06 ,  H01L23/02 ,  H01L23/16 ,  G01S7/03 ,  G01S13/88 ,  H01L23/055 ,  H01L23/552 ,  H01L23/00 ,  H01L23/66

CPC分类号： G01F23/284 ,  G01S7/032 ,  G01S13/88 ,  H01L23/055 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： Gemäß einem Ausführungsbeispiel der Erfindung ist ein Hochfrequenzmodul zur Füllstandmessung und zur Verwendung bei Frequenzen von über 75 GHz angegeben, welches einen Mikrowellenhalbleiter, eine Leiterplatte und ein auf die Leiterplatte aufgeklebtes Gehäuse aufweist. Zur Reduzierung der benötigten Leistung erfolgt der Betrieb des Mikrowellenhalbleiters getaktet.

公开(公告)号：EP1724848B1

公开(公告)日：2018-08-15

申请号：EP06290785.2

申请日：2006-05-15

申请人： LG Electronics, Inc. ,  LG Innotek Co., Ltd.

发明人： Kim, Geun Ho ,  Lee, Seung Yeob, 402, Jeongseok Green Villa

IPC分类号： H01L33/62 ,  H01L33/54

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L33/44 ,  H01L33/507 ,  H01L33/508 ,  H01L33/54 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/8592 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099

摘要： The present invention relates to a light emitting device package and a method for manufacturing the same. The present invention has advantages in that a light emitting device is electrically connected to other devices without use of wire bonding, thereby saving a space for wire bonding and reducing the size of a package. The present invention has advantages in that there is no wire in a light emitting device by using a conductive interconnection portion so that a phosphor can be easily and uniformly applied, and an area where vertically emitted light is absorbed can be reduced so that light extraction of a device can be enhanced.

公开(公告)号：EP2869549B1

公开(公告)日：2018-08-08

申请号：EP13809413.1

申请日：2013-06-20

申请人： Sony Corporation

发明人： UENO Toshihide ,  KUME Tomomi ,  SHIMIZU Masahiko

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/854 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to a camera module in which a thin camera module can be realized at a low cost and an electronic device. The camera module includes a lens unit that stores a lens that condenses light on a light receiving surface of an image sensor; a rigid substrate on which the image sensor is disposed; and a flexible substrate electrically connected with the rigid substrate, wherein in the case where the light receiving surface of the image sensor locates at the top, the lens unit, the flexible substrate, and the rigid substrate are disposed in this order from the top.

公开(公告)号：EP2727143B1

公开(公告)日：2018-04-11

申请号：EP12732961.3

申请日：2012-07-02

申请人： Vestas Wind Systems A/S

发明人： ABEYASEKERA, Tusitha ,  ANDERSEN, Thomas Lundgren ,  MØLLER, Henrik B. ,  STYHM, Ove

IPC分类号： H01L23/34 ,  H01L23/473 ,  H01L25/065 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/46 ,  H01L23/473 ,  H01L23/4924 ,  H01L23/4926 ,  H01L23/585 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/13055 ,  H02B1/56 ,  H05K7/20 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

公开(公告)号：EP3243217A4

公开(公告)日：2018-01-10

申请号：EP16735133

申请日：2016-01-04

申请人： SAMSUNG ELECTRONICS CO LTD

发明人： BEAK O-HYUN ,  KUK KEON ,  KO YOUNG-CHUL ,  KIM WOON-BAE

IPC分类号： H01L23/60 ,  H01L21/56 ,  H01L23/552

CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/291 ,  H01L23/295 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15331 ,  H04W4/001 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.