公开(公告)号：EP3211041A4

公开(公告)日：2018-06-27

申请号：EP15851902

申请日：2015-10-22

Applicant: NAMICS CORP

Inventor： SASAKI KOJI ,  MIZUMURA NORITSUKA

IPC: C08L101/12 ,  C08K3/08 ,  H01B1/22

CPC classification number: H01L24/29 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/003 ,  C08L67/00 ,  C08L101/12 ,  C08L2203/20 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J167/00 ,  C09J171/00 ,  C09J183/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/061 ,  H01L2924/0675 ,  H01L2924/068 ,  H01L2924/069 ,  H01L2924/07001 ,  H01L2924/35121

Abstract: The present invention is to provide a conductive composition which can form bonded portion capable of maintaining a thickness of the bonded portion and can maintain bonding strength, and electronic parts using the same. The present invention is the conductive composition comprising (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart obtained by a measurement using a differential scanning calorimeter is within the range of 80°C to 170°C. The maximal value of the endothermic peak in a DSC chart obtained by a measurement using a differential scanning calorimeter of the thermoplastic resin particles (C) is preferably in the range of 110°C to 140°C.