Abstract:
A semiconductor integrated circuit device is comprised a main memory portion, a sub memory portion composed of a plurality of memory cell groups and a bi-directional data transfer circuit provided between the main memory portion and the sub memory portion, wherein power source voltages of the main memory portion and the sub memory portion are different from each other. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A semiconductor integrated circuit device is comprised a main memory portion constructed with memory cells arranged in a plurality of rows and in a plurality of columns, a sub memory portion constructed with a plurality of memory cells arranged in a plurality of rows and in a plurality of columns and a bi-directional data transfer circuit for connecting the main memory portion and the sub memory portion through data transfer bus lines, respectively, wherein the data transfer bus lines in a memory cell area of the main memory portion are arranged in parallel to bit lines in a column direction and connected to the bit lines through a column selection circuit. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A column selector (34) of a dynamic random access memory device is implemented by a plurality of switching circuits (341-34m) for transferring a potential difference from a sense amplifier (SA1-SAm) to a shared data line pair (DL1/DL2), and one of the switching circuits selectively discharge the data lines (DL1/DL2) of the pair to a ground voltage line (GND) for transferring the potential difference to the shared data line pair, wherein a potential control circuit (37) is coupled between the switching circuits and the ground voltage line for decreasing the current (I) flowing from the data line to the ground voltage line after production of an output data signal (Dout), thereby decreasing the current consumption.
Abstract:
A semiconductor integrated circuit device is comprised a main memory portion, a sub memory portion composed of a plurality of memory cell groups and a bi-directional data transfer circuit provided between the main memory device and said sub memory portion, wherein a bi-directional data transfer between an arbitrary area of said main memory portion and the plurality of the memory cell groups and a read or write operation are performed simultaneously. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A semiconductor integrated circuit device is comprised a main memory portion, a sub memory portion composed of a plurality of memory cell groups and a bi-directional data transfer circuit provided between the main memory device and said sub memory portion, wherein a bi-directional data transfer between an arbitrary area of said main memory portion and the plurality of the memory cell groups and a read or write operation are performed simultaneously. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A semiconductor integrated circuit device is comprised a main memory portion and a sub memory portion composed of a plurality of memory cell groups, wherein a bi-directional data transfer is performed between an arbitrary area of the main memory portion and each of the plurality of the memory cell groups and the plurality of the memory cell groups function as independent cache memories, respectively. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A semiconductor integrated circuit device is comprised a main memory portion composed of a plurality of memory cells arranged in a plurality of rows and in a plurality of columns, a sub memory portion composed of a plurality of memory cells arranged in a plurality of rows and in a plurality of columns, a bi-directional data transfer circuit for connecting the main memory portion and the sub memory portion through data transfer bus lines, respectively, the sub memory portion being constituted with a plurality of memory cell groups, and a plurality of registers provided such that different data input/output modes are set independently for the plurality of the memory cell groups. Therefore, the semiconductor integrated circuit device of the present invention has a main memory suitable for being accessed from a plurality of data processors.
Abstract:
A column selector (34) of a dynamic random access memory device is implemented by a plurality of switching circuits (341-34m) for transferring a potential difference from a sense amplifier (SA1-SAm) to a shared data line pair (DL1/DL2), and one of the switching circuits selectively discharge the data lines (DL1/DL2) of the pair to a ground voltage line (GND) for transferring the potential difference to the shared data line pair, wherein a potential control circuit (37) is coupled between the switching circuits and the ground voltage line for decreasing the current (I) flowing from the data line to the ground voltage line after production of an output data signal (Dout), thereby decreasing the current consumption.
Abstract:
The semiconductor memory device includes at least one pair of redundant digit lines (RD,RDb), first input/output lines (IO,IOb) connected to a pair of digit lines (D,Db) via a respective sense amplifier (SA) and a switch (SW), second input/output lines (IO',IOb')connected to the redundant digit line pair (RD,RDb) via a sense amplifier (RSA) and switch (RSW), and selective amplifier means (IOSW, IOSW`, RIOSW, RIOSW`) for amplifying second input/output lines when redundant digit lines are selected. With this configuration, even when the redundant digit line pair is substituted for the digit line pair, it is possible to execute the redundancy operation by mere translation between these input/output line pairs.