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公开(公告)号：EP1441046A4
公开(公告)日：2004-12-22
申请号：EP02751623
申请日：2002-07-17
CPC分类号： C23C28/00 , C23C30/00 , H05K3/384 , H05K3/389 , Y10T428/12438 , Y10T428/12569 , Y10T428/12611 , Y10T428/12792 , Y10T428/12882 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
摘要： The present invention provides a surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications. The surface treated copper foil of the present invention comprises a copper foil provided a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided to the S side and/or the M side thereof. The copper foil of the present invention has adequate adhesive strength even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.
摘要翻译： 本发明提供一种表面处理铜箔，其具有改进的对覆铜层压板的绝缘树脂的粘附性，用于更高频率的应用。 本发明的表面处理铜箔包括在其至少一侧依次设置有耐热层和烯烃系硅烷偶联剂层的铜箔。 可以在耐热处理后进行防锈处理。 铜箔优选为电解铜箔，这些层可以设置在S侧和/或M侧。 本发明的铜箔即使没有过去进行的粗糙化处理也具有足够的粘合强度。 可以有利地使用锌，锌 - 锡，锌 - 镍，锌 - 钴，铜 - 锌，铜 - 镍 - 钴或镍 - 钴的薄膜作为耐热层，并且已经经历了锌 铬酸盐或铬酸盐处理可以有利地用作防腐层。
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2.发明公开MONOCARBOXYLATE SALTS OF IMIDAZOLE REACTION PRODUCTS, PROCESS FOR PREPARING THE SALTS, AND SURFACE TREATMENTS, ADDITIVES FOR RESINS, AND RESIN COMPOSITIONS, CONTAINING THE SAME 有权IMIDAZOLREAKTIONSPRODUKTEN，产盐的方法，并完成一元酸盐，配件，树脂和树脂组合物含有这些
公开(公告)号：EP1277757A4
公开(公告)日：2003-04-16
申请号：EP01902777
申请日：2001-02-06
IPC分类号： C07F7/18 , C08G73/06 , C08K5/5415 , C08K5/544 , C08K5/5465 , C08L79/08 , C08L101/00 , H05K3/38 , C23C22/00
CPC分类号： C07F7/1836 , C08G73/0616 , C08K5/5442 , C08K5/5465 , C23C2222/20
摘要： Novel salts of imidazole reaction products with organic monocarboxylic acids, which salts can enhance the adhesion between resins and metals including copper, steel and aluminum or inorganic materials including glass fiber, silica, aluminum oxide and aluminum hydroxide; a process for preparing the salts; and surface treatments, additives for resins, and resin compositions, containing the salts. The salts are each prepared by reacting an imidazole of the general formula (1) with a glycidoxy-bearing silane compound of the general formula (2) at 80 to 200 DEG C, and then with an organic monocarboxylic acid at 50 to 200 DEG C. (1) (2)
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3.发明公开BASIC SILANE COUPLING AGENT-ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARING THE SALT COMPOSITION AND EPOXY RESIN COMPOSITIONS CONTAINING THE SAME 有权含有盐的组合物和环氧树脂的制造含有碱性硅烷偶联剂和有机羧酸，METHOD盐组合物
公开(公告)号：EP1452535A4
公开(公告)日：2006-02-08
申请号：EP02765355
申请日：2002-08-27
IPC分类号： C08L63/00 , C07F7/18 , C08G59/42 , C08K5/5465 , C08K5/549 , C09D7/12 , C09D163/00 , C08G59/40
CPC分类号： C08G59/4238 , C07F7/1836
摘要： The invention provides a composition which is solid at room temperatures and excellent in storage stability and functions as an effective additive for epoxy resins, and a process for the preparation of the composition. The composition comprises a salt of a basic silane coupling agent with an organic carboxylic acid and is prepared by reacting a basic silane coupling agent with an organic carboxylic acid to form a salt of the agent with the acid, and then mixing under heating the resulting product with a compound which has a high affinity for the agent or the acid and a softening or melting point of 40 DEG C or above.
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4.发明公开
公开(公告)号：EP1574599A4
公开(公告)日：2006-08-02
申请号：EP03769899
申请日：2003-10-10
发明人： KUMAGAI MASASHI , HANAFUSA MIKIO
CPC分类号： C25D3/38 , C25D1/04 , Y10T428/12903
摘要： A copper electrolytic solution for obtaining a low profile electrolytic copper foil having reduced surface roughness on the rough surface side (side opposite to glossy surface) in the production of an electrolytic copper foil by the use of a cathode drum. In particular, a copper electrolytic solution for obtaining an electrolytic copper foil that excels in high-frequency transmission loss characteristics, enabling realization of fine pattern and excels in elongation and tensile strength at ordinary and high temperatures. The copper electrolytic solution comprises, as additives, (A) at least one quaternary amine salt selected from among quaternary amine salts (a) being products of reaction between epichlorohydrin and an amine compound mixture consisting of a secondary amine compound and a tertiary amine compound and polyepichlorohydrin quaternary amine salts (b) and (B) an organic sulfur compound.
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5.发明公开COPPER ELECTROLYTIC SOLUTION CONTAINING QUATERNARY AMINE COMPOUND POLYMER OF SPECIFIED SKELETON AND ORGANIC SULFUR COMPOUND AS ADDITIVES AND ELECTROLYTIC COPPER FOIL PRODUCED THEREWITH 审中-公开铜电解液溶液，其中含有选自季氨基化合物的聚合物与特定框架和有机硫化合物作为附件和产生的电解铜箔
公开(公告)号：EP1607495A4
公开(公告)日：2006-07-12
申请号：EP03788704
申请日：2003-09-17
发明人： KUMAGAI MASASHI , HANAFUSA MIKIO
CPC分类号： C25D3/38 , Y10T428/12993
摘要： In the production of an electrolytic copper foil by means of a cathode drum, there is obtained a low-profile electrolytic copper foil having a low surface roughness on the roughened surface side (side opposite to glossy surface), especially an electrolytic copper foil that enables formation of fine pattern and excels in the tensile strength and elongation at ordinary and high temperatures. In particular, a copper electrolytic solution comprising a quaternary amine compound polymer, the quaternary amine compound polymer obtained by homopolymerization of an acrylic compound having a dialkylamino group whose nitrogen is quaternized or by copolymerization of the acrylic compound with another compound having unsaturated bond, and an organic sulfur compound as additives; and an electrolytic copper foil produced with the use of this copper electrolytic solution.
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6.发明公开COPPER ELECTROLYTE COMPRISING AMINE COMPOUND HAVING SPECIFIC SKELETON AND ORGANIC SULFUR COMPOUND AND ELECTROLYTIC COPPER FOIL PREPARED USING THE SAME 有权铜电解液的解决方案，带特殊帧中的AMIN连接和有机硫化合物包含，并且由铜电解质片
公开(公告)号：EP1524335A4
公开(公告)日：2006-03-29
申请号：EP03730553
申请日：2003-05-21
发明人： KUMAGAI MASASHI , HANAFUSA MIKIO
CPC分类号： C25D7/0614 , C25D1/04 , C25D3/38 , H05K1/09 , Y10T428/12903 , Y10T428/12993 , Y10T428/26
摘要： A copper electrolyte which comprises, as additives, an organic sulfur compound and an amine compound which is prepared by the addition reaction of a compound having one or more epoxy groups in one molecule with an amine compound and has a specific skeleton represented by the following general formula (1): (1) wherein R1 and R2 are selected form the group consisting of a hydroxyalkyl group, an ether moiety, an aromatic group, an alkyl group substituted with an aromatic group, an unsaturated hydrocarbon group and an alkyl group, A represents an epoxy compound residue and n represents an integer of one or greater. The above copper electrolyte can be used in the preparation of an electrolytic copper foil using a cathode drum, for preparing a low profile electrolytic copper foil wherein the roughness side surface (the surface opposite to a glossy surface) thereof has a low surface roughness, especially, a copper foil capable of being finely patterned and being excellent in the elongation and tensile strength at ordinary and high temperatures.
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7.发明公开ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARATION THEREOF AND ADDITIVES FOR EPOXY RESINS 有权有机碳ACID，METHOD FOR THEIR和添加剂环氧树脂盐组合物
公开(公告)号：EP1452536A4
公开(公告)日：2006-02-01
申请号：EP02765356
申请日：2002-08-27
IPC分类号： C07B61/00 , C07F7/18 , C08G59/40 , C08G59/42 , C08G59/58 , C09D5/03 , C09D163/00 , H05K3/28 , C08L63/00
CPC分类号： C07F7/1836 , C08G59/4238 , C08G59/58 , H05K3/287
摘要： The invention provides an organic carboxylic acid salt composition which has a long pot life and can cure epoxy resins and improve the adhesive properties of the resins, and a process for the preparation of the same, specifically, an organic carboxylic acid salt composition obtained by mixing under heating a basic silane coupling agent with an amine having a softening or melting point of 40 DEG C or above and an organic carboxylic acid, a process for the preparation of the composition, additives for epoxy resins containing the composition as the active ingredient, and epoxy resin compositions containing the additives. Preferred examples of the basic silane coupling agent include specific imidazolyl-bearing silane coupling agents, amino-bearing silane coupling agent, dialkylamino-bearing silane coupling agents, monomethylamino-bearing silane coupling agents, benzimidazolyl-bearing silane coupling agents, benzotriazolyl-bearing silane coupling agents, and pyridyl-bearing silane coupling agents.
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