SURFACE-TREATED COPPER FOIL
    1.
    发明公开
    SURFACE-TREATED COPPER FOIL 有权
    OBERFLÄCHENBEHANDELTEKUPFERFOLIE

    公开(公告)号:EP1441046A4

    公开(公告)日:2004-12-22

    申请号:EP02751623

    申请日:2002-07-17

    摘要: The present invention provides a surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications. The surface treated copper foil of the present invention comprises a copper foil provided a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at least one side thereof. An anticorrosive treatment may be performed after the heat resistance treatment. The copper foil is preferably an electrolytic copper foil, and these layers can be provided to the S side and/or the M side thereof. The copper foil of the present invention has adequate adhesive strength even without the roughening treatment that has been performed in the past. A film of zinc, zinc-tin, zinc-nickel, zinc-cobalt, copper-zinc, copper-nickel-cobalt, or nickel-cobalt can be used favorably as the heat-resistant layer, and a film that has undergone a zinc-chromate or a chromate treatment can be used favorably as the anticorrosive layer.

    摘要翻译: 本发明提供一种表面处理铜箔,其具有改进的对覆铜层压板的绝缘树脂的粘附性,用于更高频率的应用。 本发明的表面处理铜箔包括在其至少一侧依次设置有耐热层和烯烃系硅烷偶联剂层的铜箔。 可以在耐热处理后进行防锈处理。 铜箔优选为电解铜箔,这些层可以设置在S侧和/或M侧。 本发明的铜箔即使没有过去进行的粗糙化处理也具有足够的粘合强度。 可以有利地使用锌,锌 - 锡,锌 - 镍,锌 - 钴,铜 - 锌,铜 - 镍 - 钴或镍 - 钴的薄膜作为耐热层,并且已经经历了锌 铬酸盐或铬酸盐处理可以有利地用作防腐层。

    ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARATION THEREOF AND ADDITIVES FOR EPOXY RESINS
    2.
    发明公开
    ORGANIC CARBOXYLIC ACID SALT COMPOSITION, PROCESS FOR PREPARATION THEREOF AND ADDITIVES FOR EPOXY RESINS 有权
    有机碳ACID,METHOD FOR THEIR和添加剂环氧树脂盐组合物

    公开(公告)号:EP1452536A4

    公开(公告)日:2006-02-01

    申请号:EP02765356

    申请日:2002-08-27

    摘要: The invention provides an organic carboxylic acid salt composition which has a long pot life and can cure epoxy resins and improve the adhesive properties of the resins, and a process for the preparation of the same, specifically, an organic carboxylic acid salt composition obtained by mixing under heating a basic silane coupling agent with an amine having a softening or melting point of 40 DEG C or above and an organic carboxylic acid, a process for the preparation of the composition, additives for epoxy resins containing the composition as the active ingredient, and epoxy resin compositions containing the additives. Preferred examples of the basic silane coupling agent include specific imidazolyl-bearing silane coupling agents, amino-bearing silane coupling agent, dialkylamino-bearing silane coupling agents, monomethylamino-bearing silane coupling agents, benzimidazolyl-bearing silane coupling agents, benzotriazolyl-bearing silane coupling agents, and pyridyl-bearing silane coupling agents.