摘要:
High density plasma is obtained by generating plasma by electron cyclotron resonance utilizing microwave and entrapping it inside a plasma generation chamber by a mirror magnetic field. A target is disposed inside the plasma generation chamber in a direction crossing at right angles the magnetic flux, and sputtered by ions in the high density plasma and large quantities of ions can be generated. The ions and neutral particles are taken out in the direction orthogonal to the magnetic flux and deposited on a substrate. In this manner, a thin film can be formed at a high speed without the impingement of the high energy particles onto the substrate. The thin film can be formed also on a tape-like substrate by taking out the ions and the neutral particles through a slit-like opening portion.
摘要:
High density plasma is obtained by generating plasma by electron cyclotron resonance utilizing microwave and entrapping the plasma in a plasma generation chamber by a mirror magnetic field. A target (23) is disposed in the plasma generation chamber (14) and is sputtered by ions in the high density plasma. Thus, large quantities of ions can be generated. The ion generation apparatus of the invention can be applied to a thin film formation apparatus which introduces the ions and neutral particles onto a substrate (21) to form a thin film, and also to an ion source by providing an ion pickup grid in order to form a thin film on the substrate or to etch the thin film. The film can be formed at a high speed even when the voltage to be applied to the target is reduced, by disposing permanent magnets (34A, 34B) for leaking the inner surface magnetic flux of the target at the positions corresponding to the upper and lower ends of the target (23) in the plasma generation chamber (14).
摘要:
High density plasma is obtained by generating plasma by electron cyclotron resonance utilizing microwave and entrapping the plasma In a plasma generation chamber by a mirror magnetic field. A target (23) is disposed in the plasma generation chamber (14) and is sputtered by Ions in the high density plasma. Thus, large quantities of ions can be generated. The ion generation apparatus of the invention can be applied to a thin film formation apparatus which Introduces the ions and neutral particles onto a substrate (21) to form a thin film, and also to an ion source by providing an ion pickup grid in order to form a thin film on the substrate or to etch the thin film. The film can be formed at a high speed even when the voltage to be applied to the target is reduced, by disposing permanent magnets (34A, 34B) for leaking the inner surface magnetic flux of the target at the positions corresponding to the upper and lower ends of the target (23) ln the plasma generation chamber (14).
摘要:
High density plasma is obtained by generating plasma by electron cyclotron resonance utilizing microwave and entrapping it inside a plasma generation chamber by a mirror magnetic field. A target is disposed inside the plasma generation chamber in a direction crossing at right angles the magnetic flux, and sputtered by ions in the high density plasma and large quantities of ions can be generated. The ions and neutral particles are taken out in the direction orthogonal to the magnetic flux and deposited on a substrate. In this manner, a thin film can be formed at a high speed without the impingement of the high energy particles onto the substrate. The thin film can be formed also on a tape-like substrate by taking out the ions and the neutral particles through a slit-like opening portion.