公开(公告)号：EP1004630A4

公开(公告)日：2002-03-13

申请号：EP99923894

申请日：1999-06-03

申请人： NITTO DENKO CORP

发明人： TANIGUCHI TAKASHI ,  YAMANE MINORU ,  NISHIOKA TSUTOMU ,  HARADA TADAAKI ,  HOSOKAWA TOSHITSUGU ,  IKEMURA KAZUHIRO ,  MISUMI SADAHITO ,  OHIZUMI SHINICHI

IPC分类号： C08L63/00 ,  H01L23/29 ,  C08G59/62 ,  C08K3/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10S524/904 ,  Y10S525/934 ,  C08L61/04 ,  C08L2666/22 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor sealing epoxy resin containing an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler, which has the following properties, (X) to (Z): (X) 50 to 500 poise in terms of a viscosity at 175 °C, as measured using a flow tester, (Y) 1 x 105 poise or less in terms of the minimum melt viscosity, in a temperature distribution of viscosity, as measured at a shear rate of 5 (1/s) by means of a dynamic viscoelasticity measuring apparatus, and (Z) 2.0 or more in terms of a viscosity ratio (Z1/Z2) of a viscosity at 90 °C (Z1) to a viscosity at 110 °C (Z2), as measured at a shear rate of 5 (1/s) by means of a dynamic viscoelasticity-measuring apparatus. The semiconductor sealing epoxy resin is free from the occurrence of shift of the position of a semiconductor element by flow of a resin during sealing and of tilt of a chip by metal wire run or the like, and can be used for providing a semiconductor device exhibiting high reliability.