公开(公告)号：EP2738826A2

公开(公告)日：2014-06-04

申请号：EP13194813.5

申请日：2013-11-28

申请人： NITTO DENKO CORPORATION

发明人： Matsuda, Hirokazu ,  Ona, Haruka ,  Ooyabu, Yasunari

IPC分类号： H01L33/52 ,  H01L33/56 ,  H01L33/50

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08L83/06 ,  C09D183/14 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/005 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 µm or more.

摘要翻译： 用于通过引线键合连接来封装安装在基板上的光学半导体元件的封装片包括用于嵌入光学半导体元件和导线的嵌入层以及覆盖嵌入层的覆盖层。 嵌入层和覆盖层含有含有过渡金属的催化剂，并且由通过加速催化剂的反应而固化的有机硅树脂组合物制备。 覆盖层中过渡金属的浓度与包埋层中过渡金属的浓度之比为1或更大。 从埋入层与覆盖层之间的界面到最靠近覆盖层侧的导线部分的长度为150μm以上。

公开(公告)号：EP2750210A2

公开(公告)日：2014-07-02

申请号：EP13197119.4

申请日：2013-12-13

申请人： NITTO DENKO CORPORATION

发明人： Matsuda, Hirokazu ,  Ona, Haruka

IPC分类号： H01L33/52 ,  B29C43/18 ,  H01L33/56

CPC分类号： H01L33/52 ,  B29C43/18 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2933/005 ,  Y10T428/265 ,  H01L2924/00014

摘要： An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 µm or more and 1,000 µm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.

摘要翻译： 本发明提供一种封装光半导体元件的封装用片，其包括：埋入光半导体元件的埋入层;相对于埋入层在厚度方向的一侧配置的覆盖层;以及介于埋入层与 覆盖层; 具有50μm以上且1,000μm以下的厚度; 并用于抑制包含在覆盖层中的组分向嵌入层的转移。

公开(公告)号：EP2738826A3

公开(公告)日：2014-06-11

申请号：EP13194813.5

申请日：2013-11-28

申请人： NITTO DENKO CORPORATION

发明人： Matsuda, Hirokazu ,  Ona, Haruka ,  Ooyabu, Yasunari

IPC分类号： H01L33/52 ,  H01L33/56 ,  H01L33/50

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08L83/06 ,  C09D183/14 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/005 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 µm or more.

公开(公告)号：EP2677006A1

公开(公告)日：2013-12-25

申请号：EP13172708.3

申请日：2013-06-19

申请人： NITTO DENKO CORPORATION

发明人： Ona, Haruka ,  Katayama, Hiroyuki

IPC分类号： C08L83/04 ,  G02B1/04 ,  C08G77/16 ,  C08G77/20 ,  C08K3/10 ,  C08K5/10

CPC分类号： C07F7/087 ,  C08G77/16 ,  C08G77/20 ,  C08K5/5425 ,  C08K2201/014 ,  C08L83/04 ,  G02B1/04

摘要： A first silicone resin composition is prepared by allowing an organopolysiloxane containing silanol groups at both ends containing silanol groups at both ends of a molecule and a silicon compound containing, in one molecule, at least two leaving groups leaving by a condensation reaction with the silanol groups to undergo the condensation reaction in the presence of a condensation catalyst. The silicon compound contains a trifunctional silicon compound containing, in one molecule, the three leaving groups and a bifunctional silicon compound containing, in one molecule, the two leaving groups.

摘要翻译： 通过使分子的两端含有硅烷醇基的硅烷醇基的含有机聚硅氧烷和在一分子中含有至少两个离去基团的硅化合物，通过与硅烷醇基团进行缩合反应离开，制备第一有机硅树脂组合物 在缩合催化剂存在下进行缩合反应。 硅化合物含有在一个分子中含有三个离去基团和在一个分子中含有两个离去基团的双官能硅化合物的三官能硅化合物。

公开(公告)号：EP2750210A3

公开(公告)日：2014-12-24

申请号：EP13197119.4

申请日：2013-12-13

申请人： NITTO DENKO CORPORATION

发明人： Matsuda, Hirokazu ,  Ona, Haruka

IPC分类号： H01L33/52 ,  B29C43/18 ,  H01L33/56

CPC分类号： H01L33/52 ,  B29C43/18 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2933/005 ,  Y10T428/265 ,  H01L2924/00014

摘要： An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 µm or more and 1,000 µm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer.

公开(公告)号：EP2677005A1

公开(公告)日：2013-12-25

申请号：EP13172705.9

申请日：2013-06-19

申请人： NITTO DENKO CORPORATION

发明人： Ona, Haruka ,  Katayama, Hiroyuki ,  Nakanishi, Sadahiro

IPC分类号： C08L83/04 ,  G02B1/04 ,  C08G77/16 ,  C08G77/20 ,  C08K3/10 ,  C08K5/10

CPC分类号： H01L33/56 ,  C08G77/16 ,  C08G77/20 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

摘要： A silicone resin composition contains a polysiloxane containing at least one pair of condensable substituted groups capable of condensation by heating and at least one pair of addable substituted groups capable of addition by an active energy ray.

摘要翻译： 一种硅树脂组合物含有聚硅氧烷通过加热和至少一对能加成到由活性能量射线可添加的组substituiertem的含至少一对能够缩合的冷凝substituiertem组。

公开(公告)号：EP2586831A1

公开(公告)日：2013-05-01

申请号：EP12189406.7

申请日：2012-10-22

申请人： NITTO DENKO CORPORATION

发明人： Ona, Haruka ,  Katayama, Hiroyuki

IPC分类号： C08L83/04 ,  H01L23/29

CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  H01L23/296 ,  H01L33/56 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane.

(where, in formula, R 1 represents a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. R 2 represents hydrogen or a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. The molar ratio of the monovalent hydrocarbon group: hydrogen in R 2 in the cage octasilsesquioxane as a whole is, as an average value, in the range of 6.5:1.5 to 5.5:2.5.)

摘要翻译： 硅氧烷树脂组合物含有具有下式（1）表示的基团的保持基倍半硅氧烷，含有在笼式八倍半硅氧烷中的氢化硅烷基数多的烯基的含烯基的聚硅氧烷，氢化硅烷化催化剂 ，和有机氢聚硅氧烷。 （式中，R 1表示选自饱和烃基和芳香族烃基的一价烃基，R 2表示氢或选自饱和烃基和芳香族烃基的一价烃基，摩尔比 作为平均值，笼式八倍半硅氧烷中的R 2中的一价烃基：氢在6.5:1.5〜5.5:2.5的范围内。