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公开(公告)号：EP3157163B1
公开(公告)日：2018-07-11
申请号：EP15806040.0
申请日：2015-05-08
申请人： NSK Ltd.
IPC分类号： H02P27/06 , B62D5/04 , B62D6/00 , B62D137/00
CPC分类号： B62D5/0484 , B62D5/046 , B62D5/0481 , B62D5/0496 , H02P27/08 , H02P29/68
摘要： [Problem] An object of the present invention is to provide a motor control apparatus that, with a high reliability, protects the motor release-switch comprising the semiconductor switching elements in small size and an electric power steering apparatus provided the same. [Means for solving the problem] An electric power steering apparatus that drive-controls a motor by an inverter, and a motor release-switch is connected between the inverter and the motor, comprising: a control section to detect an assist state on a driving control system and to ON/OFF-switch a control of the inverter based on a detection result; a motor rotational number detecting section to detect a rotational number of the motor; an energy calculating section to calculate an energy of a motor back-EMF and a regenerative current based on the rotational number; and a judging section to compare the energy with an area of safety operation of the motor release-switch and to OFF-switch the d motor release-switch when the energy becomes within the area of safety operation. As occasion demands, the area of safety operation is calculated with the temperature.
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公开(公告)号：EP3611830A1
公开(公告)日：2020-02-19
申请号：EP18809109.4
申请日：2018-06-01
申请人： NSK Ltd.
摘要： An electric drive device and an electric power steering device that reduce temperature increase of a magnetic sensor are provided. The electric drive device includes: an electric motor; an electronic control device including a magnet at an anti-load side end of a shaft to control drive of the electric motor, and a circuit board on the anti-load side of the shaft on an extended line in an axial direction of the shaft; first coil wiring connecting the first coil groups of the electric motor to the circuit board; and second coil wiring connecting the second coil groups of the electric motor to the circuit board. Each of the first and second coil wiring includes a first portion projecting in a direction intersecting the axial direction of the shaft to the outside of the housing, and a second portion projecting outside the housing from the first portion toward the circuit board.
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公开(公告)号：EP3386277A1
公开(公告)日：2018-10-10
申请号：EP16870526.7
申请日：2016-11-24
申请人： NSK Ltd.
发明人： SHIMAKAWA, Shigeru
CPC分类号： H01L23/3675 , B60R16/0231 , B62D5/04 , H01L23/12 , H01L23/36 , H01L24/32 , H01L24/33 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/13091 , H05K1/02 , H05K7/209
摘要： Provided are a heat dissipation substrate capable of improving heat dissipation properties of an electronic component, and an electric power steering device. In the heat dissipation substrate, a plurality of thermal vias are disposed at least in an electronic component projection region in which a region of a bottom surface portion of the electronic component is projected to a mounting surface in a direction perpendicular to the mounting surface, and a surface density of the thermal vias which occupy the mounting surface per unit area is at least partially different. The plurality of thermal vias are disposed so that the surface density of the thermal vias becomes the greatest in a dense region on an inner side of an edge portion of the electronic component projection region.
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公开(公告)号：EP3196931A1
公开(公告)日：2017-07-26
申请号：EP15861565.8
申请日：2015-11-20
申请人： NSK Ltd.
CPC分类号： H01L23/50 , H01L23/12 , H01L23/36 , H01L23/48 , H01L24/40 , H01L2924/0002 , H01L2924/00
摘要： [Problem]
An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.
[Means for Solving]
The present invention is an electronic part mounting heat-dissipating substrate which comprises: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape摘要翻译： 发明内容本发明的目的在于提供一种电子部件安装用散热基板，该电子部件安装用散热基板能够使用流过大电流的功率半导体的电路来降低大功率动作的布线电阻， 散热。 用于解决问题的手段本发明是一种电子部件安装散热基板，其包括：导体板，其形成在布线图案形状的引线框上; 以及绝缘构件，其设置在导体板上的布线图案形状的引线框之间; 其特征在于，所述导体板的部件配置面的板面与所述部件配置面侧的所述绝缘部件的顶面形成一个连续面，所述导体的所述部件配置面的背面的板面 在所述部件配置面侧的所述背面侧的所述绝缘部件的上表面形成为同一平面，所述基板形成为圆形
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