A SENSOR CHIP AND A METHOD OF MANUFACTURING THE SAME
    2.
    发明公开
    A SENSOR CHIP AND A METHOD OF MANUFACTURING THE SAME 有权
    传感器芯片及其制造方法

    公开(公告)号:EP2263078A1

    公开(公告)日:2010-12-22

    申请号:EP09727454.2

    申请日:2009-03-19

    Applicant: NXP B.V.

    CPC classification number: G01N33/5438 G01N27/226

    Abstract: A sensor chip (100) for detecting particles, the sensor chip (100) comprising a substrate (102), an electric connection structure (104) arranged in a surface portion of the substrate (102) and adapted for an electric connection to an electric connection element (106), a sensor active region (108) arranged in another surface portion of the substrate (102) and being sensitive to the presence of the particles to be detected, and a continuous dielectric layer (110) covering the substrate (102) including covering the electric connection structure (104) and the sensor active region (108).

    INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR
    3.
    发明授权
    INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR 有权
    根据上述制造GRID和处理集成电路

    公开(公告)号:EP2331920B1

    公开(公告)日:2012-07-25

    申请号:EP09787185.9

    申请日:2009-09-12

    Applicant: NXP B.V.

    CPC classification number: G01J3/02 G01J3/021 G01J3/0259 G01J3/18 G01J3/2803

    Abstract: Disclosed is an integrated circuit (100) comprising a substrate (110) carrying a plurality of light-sensitive elements (112) and a blazed grating (120) comprising a plurality of diffractive elements (122) for diffracting respective spectral components (123-125) of incident light (150) to respective light-sensitive elements (112), the blazed grating (120) comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions (202, 222, 242) arranged such that each diffractive element (122) comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.

    INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR
    4.
    发明公开
    INTEGRATED CIRCUIT WITH GRATING AND MANUFACTURING METHOD THEREFOR 有权
    根据上述制造GRID和处理集成电路

    公开(公告)号:EP2331920A1

    公开(公告)日:2011-06-15

    申请号:EP09787185.9

    申请日:2009-09-12

    Applicant: NXP B.V.

    CPC classification number: G01J3/02 G01J3/021 G01J3/0259 G01J3/18 G01J3/2803

    Abstract: Disclosed is an integrated circuit (100) comprising a substrate (110) carrying a plurality of light-sensitive elements (112) and a blazed grating (120) comprising a plurality of diffractive elements (122) for diffracting respective spectral components (123-125) of incident light (150) to respective light-sensitive elements (112), the blazed grating (120) comprising a stack of layers, at least some of these layers comprising first portions, e.g. metal portions (202, 222, 242) arranged such that each diffractive element (122) comprises a stepped profile of stacked first portions with a first portion in a higher layer laterally extending beyond a first portion in a lower layer of said stepped profile.

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