公开(公告)号：EP2589055A2

公开(公告)日：2013-05-08

申请号：EP11810082.5

申请日：2011-06-27

申请人： National Semiconductor Corporation

发明人： FRENCH, William ,  HOPPER, Peter, J. ,  SMEYS, Peter ,  GABRYS, Ann ,  ANDERSON, David, I.

IPC分类号： H01F38/40 ,  H01L25/00

摘要： An integrated circuit die system comprises a first integrated circuit die, a second integrated circuit die and a transformer formed on a dielectric (e.g., quartz) substrate and electrically connected between the first integrated circuit die and the second integrated circuit die to provide galvanic isolation therebetween.

公开(公告)号：EP2589055B1

公开(公告)日：2019-12-25

申请号：EP11810082.5

申请日：2011-06-27

申请人： National Semiconductor Corporation

发明人： FRENCH, William ,  HOPPER, Peter, J. ,  SMEYS, Peter ,  GABRYS, Ann ,  ANDERSON, David, I.

IPC分类号： H01F38/40 ,  H01L25/00 ,  H01L23/64 ,  H01L23/00 ,  H01L25/065 ,  H01F19/08