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1.发明公开
公开(公告)号：EP4406024A1
公开(公告)日：2024-07-31
申请号：EP22769867.7
申请日：2022-08-24
发明人： POPOVIC, Darko , LISK, Durodami , LI, Yue
IPC分类号： H01L25/10 , H01L23/00 , H01L23/538 , H01L25/00
CPC分类号： H01L25/105 , H01L2225/103520130101 , H01L2225/105820130101 , H01L25/50 , H01L24/16 , H01L2224/1622720130101 , H01L2225/102320130101 , H01L2924/1531120130101 , H01L2924/1532120130101 , H01L24/19 , H01L2224/8100520130101 , H01L2225/104120130101 , H01L2225/109420130101 , H01L2224/1210520130101 , H01L23/49811 , H01L23/49816
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公开(公告)号：EP4377999A1
公开(公告)日：2024-06-05
申请号：EP22747907.8
申请日：2022-06-17
发明人： PATIL, Aniket , NAVAJA, Brigham , WE, Hong Bok
IPC分类号： H01L25/065 , H01L23/538 , H01L23/00 , H01L21/56 , H01L25/00 , H01L23/31 , H01L21/683
CPC分类号： H01L2224/1622720130101 , H01L2924/1531120130101 , H01L2924/1519220130101 , H01L2224/1210520130101 , H01L2224/0410520130101 , H01L2224/2413720130101 , H01L24/19 , H01L24/96 , H01L2224/7320420130101 , H01L2224/13120130101 , H01L2224/1314720130101 , H01L2224/1308220130101 , H01L2224/0822520130101 , H01L25/0655 , H01L24/13 , H01L24/16 , H01L23/3128 , H01L21/568 , H01L25/50 , H01L23/3135 , H01L21/6835 , H01L2221/6835920130101 , H01L23/5383 , H01L23/5385 , H01L23/49816
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公开(公告)号：EP4366819A2
公开(公告)日：2024-05-15
申请号：EP22838451.7
申请日：2022-07-08
CPC分类号： G01K1/14 , A61N1/0531 , A61N1/0534 , A61N1/0553 , A61B2018/0079720130101 , A61B18/148 , A61B5/4064 , A61B5/407 , A61B5/01 , A61B5/293 , A61B5/294 , A61B5/4848
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4.发明公开
公开(公告)号：EP4364203A1
公开(公告)日：2024-05-08
申请号：EP22834364.6
申请日：2022-06-09
IPC分类号： H01L25/18 , H10B12/00 , H01L25/065 , H01L25/00 , H01L23/522
CPC分类号： H10B12/34 , H10B12/315 , H10B12/50 , H10B12/482 , H10B12/488 , H01L21/2007 , H01L21/8221 , H01L27/0688
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公开(公告)号：EP3602621B1
公开(公告)日：2024-05-01
申请号：EP17715784.9
申请日：2017-03-29
IPC分类号： H01L23/473 , G02B6/00 , H01L25/00
CPC分类号： H01L23/473 , G02B6/30 , G02B6/12002 , G02B6/122 , G02B6/1228 , G02B6/125 , H01L2224/1614520130101
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公开(公告)号：EP3127151B1
公开(公告)日：2024-05-01
申请号：EP15773393.2
申请日：2015-03-30
IPC分类号： H01L23/34 , H01L23/48 , H01L25/00 , H01L25/18 , H01L25/065 , H01L23/00 , H01L23/552 , H01L23/498 , H01L23/367 , H01L23/522
CPC分类号： H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2224/1302520130101 , H01L2224/13120130101 , H01L2224/1311120130101 , H01L2224/1312420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/13320130101 , H01L2224/1614620130101 , H01L2224/1622720130101 , H01L2224/1718120130101 , H01L2224/3214520130101 , H01L2224/3222520130101 , H01L2224/7320420130101 , H01L2224/7325320130101 , H01L2224/9212520130101 , H01L2225/0651720130101 , H01L2225/0658920130101 , H01L2924/1025320130101 , H01L2924/103320130101 , H01L2924/1420130101 , H01L2924/143620130101 , H01L2924/143720130101 , H01L2924/143820130101 , H01L2924/1515620130101 , H01L2924/1519220130101 , H01L2924/1531120130101 , H01L2924/1532120130101 , H01L2924/1615220130101 , H01L2924/1625120130101 , H01L2924/1904120130101 , H01L2924/1904220130101 , H01L2924/1904320130101 , H01L2924/1910520130101 , H01L2224/132920130101 , H01L2225/0651320130101 , H01L2225/0654120130101 , H01L2225/0656520130101 , H01L2225/0656820130101 , H01L23/3675 , H01L23/3677 , H01L23/49811 , H01L23/49833 , H01L25/18 , H01L24/17 , H01L25/50 , H01L2924/143120130101 , H01L2924/143420130101 , H01L2924/1533120130101
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公开(公告)号：EP4125119B1
公开(公告)日：2024-04-17
申请号：EP22187481.1
申请日：2022-07-28
IPC分类号： H01L23/00 , H01L25/065 , H01L21/56 , H01L21/48 , H01L21/60 , C23C14/04 , C23C14/28 , H01L21/02 , H01L21/285 , H01L23/495 , H01L23/31 , H01L23/29 , H01L25/00 , H01L25/16 , H01L25/07
CPC分类号： H01L2224/2424620130101 , H01L2224/2424520130101 , H01L2224/2413720130101 , H01L2224/2410120130101 , H01L2224/2410520130101 , H01L2224/240220130101 , H01L2224/24520130101 , H01L2224/2510520130101 , H01L2224/2517120130101 , H01L2224/8203920130101 , H01L2224/8210520130101 , H01L2224/8221420130101 , H01L2224/3224520130101 , H01L2224/7326720130101 , H01L2224/9224420130101 , H01L24/82 , H01L24/24 , H01L24/25 , H01L2924/0001420130101 , H01L24/83 , H01L24/32 , H01L25/50 , H01L25/0655 , H01L25/072 , H01L25/16 , H01L21/56 , H01L21/4825 , H01L23/49575 , H01L23/295 , H01L23/3107 , H01L23/49517 , C23C14/28 , C23C14/048
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公开(公告)号：EP4287248A1
公开(公告)日：2023-12-06
申请号：EP23161217.7
申请日：2023-03-10
申请人： Kioxia Corporation
摘要： In one embodiment, a semiconductor device includes a first substrate (11), a first insulator (13) provided on the first substrate, a first pad (17) provided in the first insulator, a second insulator (21) provided on the first insulator, and a second pad (22) provided in the second insulator, disposed on the first pad, and being in contact with the first pad. The device further includes a third pad (29) provided in the second insulator, and disposed above the second pad, a third insulator (31) provided on the second insulator, and a fourth pad (32) provided in the third insulator, disposed on the third pad, and being in contact with the third pad. Furthermore, a shape of the third (29) or fourth pad (32) is different from a shape of the first (17) or second pad (22). Also disclosed is a method of manufacturing said semiconductor device.
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公开(公告)号：EP4235804A3
公开(公告)日：2023-10-25
申请号：EP23177429.0
申请日：2014-07-02
申请人： REC Solar Pte. Ltd.
摘要： A solar cell assembly (200) is presented. The solar cell assembly includes one or more solar cell units (211) coupled in series. The solar cell unit includes a first solar cell series (221) and a second solar cell series (222) connected in parallel. The first and second solar cell series include a plurality of solar cells (202) connecting in series respectively. The solar cell assembly also includes a by- pass diode (201) coupled to each solar cell unit and shared between the first and second solar cell series in each solar cell unit.
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