摘要:
The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.
摘要:
Provided is a control circuit for a thermostatic oven in an oven controlled crystal oscillator, which is capable of further improving stability of an oscillation frequency. A control circuit in which a thermistor (12) whose resistance value changes according to a temperature outputs a signal according to the ambient temperature of the thermostatic oven inside the oscillator, an operational amplifier (13) outputs a signal according to a difference between the output of the thermistor (12) and a reference signal, a power transistor (14) amplifies the output of the operational amplifier (13), and a heater (15) generates heat based on a collector voltage of the power transistor (14), is provided with a temperature sensor circuit (20) having a transistor (21) with a base to which the output of the operational amplifier (13) is input. The control circuit outputs a collector voltage of the transistor (21) as an internal temperature signal which changes according to a temperature inside the oscillator.
摘要:
A constant temperature type crystal oscillator which uses a surface mounting crystal resonator, in which a surface mounting crystal resonator (22) is mounted on a circuit board (21b) together with an oscillating element (24) and a temperature control element (25), characterised in that said crystal resonator (22) is installed on one principal plane of a ceramic substrate (34), and at least a chip resistor (35a,35b) for heat generation, and a highly temperature-dependent, highly heat-sensitive element (25a) are installed on the other principal plane of said ceramic substrate (34).
摘要:
The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.
摘要:
The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.