公开(公告)号：EP3000177A4

公开(公告)日：2016-12-28

申请号：EP14801041

申请日：2014-05-23

Applicant: RAPID DIAGNOSTEK INC

Inventor： TISCHER JOHN MARK ,  MADSEN CHRISTOPHER JENNINGS ,  MANN ROGER PAUL

IPC: H03H3/08 ,  G01N29/036 ,  G01N29/22 ,  H03H9/25 ,  H03H9/54 ,  H05K1/11

CPC classification number: H01R12/721 ,  G01N29/022 ,  G01N29/036 ,  G01N29/222 ,  G01N29/30 ,  G01N33/54373 ,  G01N2291/014 ,  G01N2291/022 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  H01L41/081 ,  H01L41/0825 ,  H03H9/54 ,  H05K1/118 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10068 ,  H05K2201/10151

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

公开(公告)号：EP0862238A2

公开(公告)日：1998-09-02

申请号：EP98103314.5

申请日：1998-02-25

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Ishii, Tetsuya ,  Katagiri, Hiroshi ,  Shingaki, Tadashi ,  Takemura, Tatsuya

IPC: H01P7/08

CPC classification number: H01P7/084 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068

Abstract: A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

Abstract translation: 要直接安装在基片上并用作例如谐振器的多层微电子电路。 多层微电子电路包括多个介质层和图案化电极，它们彼此层叠以形成层压结构，电介质层和图案化电极形成电路。 层叠结构具有沿着电介质层和图案化电极层叠的方向延伸的侧面。 输入线形成在一个侧面并与电路的输入部分连接。 输出线形成在一个侧面并与电路的输出部连接。 在一个侧面形成接地线，并与电路的接地部连接。 另外，形成在一个侧表面上用于连接电路的部分的信号线。 信号线具有位于多个微电子电路直接安装在基板上的安装表面附近的端部，其中信号线的端部与安装表面分离，从而与基板电接触绝缘。

公开(公告)号：EP2555426A4

公开(公告)日：2017-04-26

申请号：EP11765420

申请日：2011-03-24

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  KOJO YUKA

IPC: H03H9/02 ,  H01L23/04 ,  H01L23/053 ,  H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H03H9/10 ,  H05K3/34

CPC classification number: H05K5/0091 ,  H01L23/053 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/15162 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K3/3431 ,  H05K3/3442 ,  H05K5/0095 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10075 ,  Y02P70/613 ,  H01L2924/00

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal. The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract translation: 表面安装型电子部件封装的基座保持电子部件元件，并用导电性接合材料安装在电路基板上。 基座具有主表面和用于电连接到电路板的外部连接端子。 外部连接端子形成在主表面中。 基座包括形成在外部连接端子上的凸块。 凸点比外部连接端子小。 基部沿着外部连接端子上的应力的衰减方向在外部连接端子的外周端缘与凸块的外周端缘之间具有距离d。 伴随底座在电路板上的安装而产生应力。 距离d大于0.00mm并且等于或小于0.45mm。

公开(公告)号：EP3000177A1

公开(公告)日：2016-03-30

申请号：EP14801041.6

申请日：2014-05-23

Applicant: Rapid Diagnostek, Inc.

Inventor： TISCHER, John, Mark ,  MADSEN, Christopher, Jennings ,  MANN, Roger, Paul

IPC: H03H3/08 ,  H03H9/25 ,  H03H9/54

CPC classification number: H01R12/721 ,  G01N29/022 ,  G01N29/036 ,  G01N29/222 ,  G01N29/30 ,  G01N33/54373 ,  G01N2291/014 ,  G01N2291/022 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  H01L41/081 ,  H01L41/0825 ,  H03H9/54 ,  H05K1/118 ,  H05K1/184 ,  H05K2201/09063 ,  H05K2201/10068 ,  H05K2201/10151

Abstract: Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Abstract translation: 公开了利用这种互连装置的互连装置和模块和系统的各种实施例。 在一个或多个实施例中，互连装置可以包括印刷电路板（PCB）。 PCB可以包括形成可弹性偏转元件的基板，设置在基板上的导电材料，以及设置在弹性偏转元件上并电耦合到导电材料的电触点。 互连装置还可以包括连接器，该连接器包括被配置为与PCB的元件电耦合的连接引脚，并且当元件接触连接引脚时导致弹性可偏转元件偏转。

公开(公告)号：EP1624740A3

公开(公告)日：2008-07-16

申请号：EP05013421.2

申请日：2005-06-22

Applicant: ENDRESS + HAUSER WETZER GmbH + Co. KG

Inventor： Härle, Thomas ,  Konrad, Michael ,  Wührle, Markus

IPC: H05K9/00

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K2201/10068 ,  H05K2201/10727

Abstract: Die Erfindung bezieht sich auf eine Vorrichtung zur Aufnahme und zur Befestigung eines elektronischen Bauelements (9) auf einer Leiterplatte (2). Das Bauelement ist in einem Gehäuse (1) mit einer Bodenfläche (3), mit einer auf die Form der Bodenfläche (3) angepassten Anzahl von Seitenflächen (4) und mit einer entsprechenden Deckfläche (8), die aus einem elektrisch leitenden Material gefertigt ist, angeordnet. Desweiteren ist zumindest ein elektrisch leitendes Verbindungselement (7) vorgesehen, das so ausgebildet und/oder angeordnet ist, dass die Abdeckfläche (5) über das Verbindungselement (7) auf einem Bezugspotential der Leiterplatte (2) liegt.

公开(公告)号：EP0736242A4

公开(公告)日：1998-09-23

申请号：EP95930944

申请日：1995-08-25

Applicant: BAIER & BAIER INC DOING BUSINE

Inventor： BREE DANIEL R ,  LEM RAFAEL

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component (300, 810, 850) having a pair of input/output contact points (330, 332, 830, 832, 870, 872) or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces (846, 856, 858, 860) on a circuit for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0 degree (a chain configuration) and about 180 degrees (a 'U' turn).

公开(公告)号：EP0736242A1

公开(公告)日：1996-10-09

申请号：EP95930944.0

申请日：1995-08-25

Applicant: BAIER & BAIER, INC. doing business as LARK ENGINEERING

Inventor： BREE, Daniel, R. ,  LEM, Rafael

IPC: H05K1 ,  H05K3

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component (300, 810, 850) having a pair of input/output contact points (330, 332, 830, 832, 870, 872) or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces (846, 856, 858, 860) on a circuit for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0 degree (a chain configuration) and about 180 degrees (a 'U' turn).

公开(公告)号：EP1949492A1

公开(公告)日：2008-07-30

申请号：EP06837393.5

申请日：2006-11-13

Applicant: CTS Corporation

Inventor： KNECHT, Thomas, A. ,  JACOBSON, Robert ,  REESER, Glen

IPC: H01P7/04 ,  H03B5/18 ,  H05K1/00 ,  H03L7/06

CPC classification number: H03B5/1805 ,  H03B5/1221 ,  H03B5/1231 ,  H03B5/1243 ,  H03L7/06 ,  H03L7/099 ,  H03L7/16 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3mm x 14.8mm x 3.9mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

公开(公告)号：EP1598931A1

公开(公告)日：2005-11-23

申请号：EP05253115.9

申请日：2005-05-19

Applicant: Nihon Dempa Kogyo Co., Ltd.

Inventor： Ito, Manabu ,  Fukudu, Minoru ,  Kudo, Tetuo ,  Uchida, Takeshi

IPC: H03B5/36 ,  H03B5/04 ,  H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: The present invention is one where, in a lead wire led-out type crystal oscillator of constant temperature type for high stability, comprising: a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant; an oscillating element that constitutes an oscillating circuit together with the crystal resonator; a temperature control element that constitutes a temperature control circuit for controlling the temperature of the crystal resonator; and a circuit board for mounting the heat supply body, the oscillating element, and the temperature control element, and through which lead wires of the crystal resonator are passed through for mounting, the heat supply body comprises: a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator; and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 本发明是一种在高稳定性的恒温型铅丝引出型晶体振荡器中，其特征在于，包括：向多个引线引出的晶体谐振器供热的供热体， 保持温度恒定; 与晶体谐振器一起构成振荡电路的振荡元件; 构成用于控制晶体谐振器的温度的温度控制电路的温度控制元件; 以及用于安装供热体，振荡元件和温度控制元件的电路板，并且晶体谐振器的引线通过该电路板通过以进行安装，所述供热体包括：导热板， 用于引线的孔，并安装在电路板上，并且面向并直接热连接到晶体谐振器; 以及与导热板相邻地安装在电路基板上并与导热板热接合的用于加热的片状电阻器。

公开(公告)号：EP1428418A1

公开(公告)日：2004-06-16

申请号：EP02772850.0

申请日：2002-09-12

Applicant: Nec Schott Components Corporation

Inventor： FUKUSHIMA, Daisuke,NEC SCHOTT COMPONENTS CORP.

IPC: H05K3/34

CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A surface mounting package includes a metal base with a lower surface having a through hole, a metal lead arranged to be inserted into the through hole, an insulating material filling in an internal space defined by the metal base, a cap covering the metal base as a lid, and an electronic part component arranged at a surface on the internal space side of the metal lead. The internal space is held at an air-tight atmosphere. The metal base has a lower surface positioned on the same plane as a lower surface of the metal lead or the insulating material, the same plane forming a plane to be attached to a mounting board.