公开(公告)号：EP3456160A2

公开(公告)日：2019-03-20

申请号：EP17728449.4

申请日：2017-05-10

Applicant: Linxens Holding

Inventor： MORGENTHALER, Frédéric ,  KALCK, Sébastien

IPC: H05K1/11 ,  H05K3/20 ,  G06K19/077 ,  H01L23/498 ,  H05K3/00 ,  H05K3/32

CPC classification number: H05K3/202 ,  G06K19/07718 ,  G06K19/07743 ,  H01L23/49838 ,  H01L23/49855 ,  H05K1/11 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/32 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10287 ,  H05K2203/1545

公开(公告)号：EP3364455A1

公开(公告)日：2018-08-22

申请号：EP17156474.3

申请日：2017-02-16

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： VAN HECK, Gerardus ,  BARINK, Marco ,  DE KOK, Margaretha Maria

IPC: H01L23/498 ,  H05K1/02

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/09272 ,  H05K2201/10106

Abstract: The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11,12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11,12).

公开(公告)号：EP3324712A3

公开(公告)日：2018-07-25

申请号：EP17201960.6

申请日：2017-11-15

Applicant: ASUSTeK Computer Inc.

Inventor： LIN, Bing-Min ,  NG, Teng-Liang ,  TAN, Ji-Kuang ,  TSAI, Ming-Fang ,  LIN, Chih-Kuang

IPC: H05K1/14 ,  H05K1/02 ,  G06F1/18 ,  G06F1/20 ,  G06F11/30 ,  G06F11/32

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：EP3349549A1

公开(公告)日：2018-07-18

申请号：EP17151094.4

申请日：2017-01-11

Applicant: Itron Global SARL

Inventor： BOTTNER, Michel ,  CATHERIN, Daniel ,  HYVERNAT, Stéphane

IPC: H05K1/11 ,  H05K3/32 ,  H01R12/58 ,  H05K1/02

CPC classification number: H05K3/325 ,  H01R12/585 ,  H05K1/0271 ,  H05K1/0278 ,  H05K1/119 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/1059

Abstract: A solderless joint arrangement comprising a receptacle (11, 12) of a PCB (10) arranged to receive a conductive compliant pin, the receptacle (11) comprising a conductive portion (12) for contact with the compliant pin wherein the receptacle is positioned on a flexible portion (20) of the PCB.

公开(公告)号：EP2702842B1

公开(公告)日：2018-05-23

申请号：EP12864805.2

申请日：2012-04-10

Applicant: Soligie, Inc.

Inventor： TATE, Michael, J. ,  SIME, David, G.

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/189 ,  H05K1/038 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10037 ,  Y10T29/49204

Abstract: Embodiments relate to coupling and/or holding devices for electrically and/or mechanically contacting circuit elements, such as power sources, sensors, transducers and other devices. In one embodiment, a coupling device comprises a substrate having at least one printed conductive element and at least one fold, flap, slit, slot, perforation or other alteration configured to encourage contact between a circuit element, such as a battery, sensor, transducer or other element, and the at least one printed conductive element.

公开(公告)号：EP3292742A1

公开(公告)日：2018-03-14

申请号：EP16720997.2

申请日：2016-04-22

Applicant: ZKW Group GmbH

Inventor： KIESLINGER, Dietmar ,  WURM, Peter ,  IDRIZAJ, Arianit

IPC: H05K1/02 ,  H05K3/30 ,  F21S8/10 ,  H05K13/08

CPC classification number: H05K3/303 ,  F21S41/141 ,  F21S41/192 ,  H05K1/0269 ,  H05K1/181 ,  H05K13/04 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/09854 ,  H05K2201/09918 ,  H05K2201/10106 ,  Y02P70/613

Abstract: The invention relates to a method for positioning at least one electronic component (3) on a circuit board (1) provided for installation in a vehicle headlamp, wherein the circuit board (1) comprises at least one position mark and the positioning of the at least one electronic component (3) is carried out relative to the at least one position mark on the circuit board (1), wherein the at least one position mark is detected optically and is used for the positioning, wherein the at least one position mark used is at least one alignment mark (5, 6, 7, 8, 8', 8'') of the circuit board (1) which, in the vehicle headlamp, when the circuit board (1) is installed, interacts mechanically with a positioning means (9, 15) of the vehicle headlamp that is complementary to the alignment mark (5, 6, 7, 8, 8', 8').

公开(公告)号：EP3271241A1

公开(公告)日：2018-01-24

申请号：EP16765823.6

申请日：2016-03-18

Applicant: AeroVironment, Inc.

Inventor： NICOLOFF, William John

IPC: B64C1/06 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/1422 ,  B64C1/06 ,  B64C39/024 ,  B64D45/00 ,  H05K1/0271 ,  H05K1/181 ,  H05K5/0034 ,  H05K5/0217 ,  H05K7/183 ,  H05K2201/09063 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/2027 ,  H05K2201/2045 ,  H05K2203/167

Abstract: A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

公开(公告)号：EP3220096A1

公开(公告)日：2017-09-20

申请号：EP17161125.4

申请日：2017-03-15

Applicant: Rosemount Aerospace Inc.

Inventor： WHATCOTT, Neal R.

IPC: F42B35/00 ,  F42C19/06 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01R12/62 ,  F42B15/10 ,  F42B35/00 ,  F42C19/06 ,  H05K1/028 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/368 ,  H05K7/1434 ,  H05K2201/09027 ,  H05K2201/09063

Abstract: An electronic system includes first and second circuit boards (202, 204) and a flexible circuit connector (40). The flexible circuit connector is configured to electrically connect the first and second circuit boards. The flexible circuit connector includes first and second connectors (42, 44) and a spiral portion (48). The first connector is configured to connect to the first circuit board. The second connector is configured to connect to the second circuit board. The spiral portion is connected between the first and second circuit boards and includes a circumferential portion (62) that extends around the second connector.

Abstract translation: 电子系统包括第一和第二电路板（202,204）和柔性电路连接器（40）。 柔性电路连接器被配置为电连接第一和第二电路板。 柔性电路连接器包括第一和第二连接器（42,44）和螺旋部分（48）。 第一连接器被配置为连接到第一电路板。 第二连接器被配置为连接到第二电路板。 螺旋部分连接在第一和第二电路板之间并且包括围绕第二连接器延伸的周向部分（62）。

公开(公告)号：EP1880449B1

公开(公告)日：2017-09-06

申请号：EP06742279.0

申请日：2006-04-27

Applicant: OSRAM GmbH

Inventor： HACKENBUCHNER, Stefan ,  HIRSCHMANN, Günther

IPC: H01R33/945 ,  H05B41/02 ,  H05B41/04 ,  H05K1/02

CPC classification number: H05K1/0256 ,  H01R33/945 ,  H05B41/02 ,  H05B41/042 ,  H05K2201/09063 ,  H05K2201/10113

公开(公告)号：EP3207414A1

公开(公告)日：2017-08-23

申请号：EP15787116.1

申请日：2015-10-15

Applicant: Cisco Technology, Inc.

Inventor： PFNUER, Stefan ,  TRAVERSO, Matthew Joseph ,  DAMA, Bipin

IPC: G02B6/42

CPC classification number: G02B6/4257 ,  G02B6/4204 ,  G02B6/4232 ,  G02B6/428 ,  G02F1/011 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/1053

Abstract: An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.

Abstract translation: 光发射器可以包括芯片堆叠，该芯片堆叠包括使用焊球安装到光子芯片的电IC。 这些焊接连接允许电气IC和光子芯片进行通信。 另外，发射器可以包括耦合到堆叠的PCB，使得PCB中的电信号被传输到IC和光子芯片（反之亦然）。 代替使用连接到光子芯片的表面上的焊盘的焊线将PCB耦合到堆叠，PCB的至少一部分设置在光子芯片和电IC之间。 PCB还可以包括用于形成到电IC的直接焊接连接的接合焊盘。 如此，电IC可以包括到PCB和光子芯片的直接焊接连接。