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    LIGHT DETECTION DEVICE, IMAGE-CAPTURING DEVICE, AND IMAGE-CAPTURING ELEMENT
    2.
    发明公开
    LIGHT DETECTION DEVICE, IMAGE-CAPTURING DEVICE, AND IMAGE-CAPTURING ELEMENT 审中-公开
    光检测装置，图像捕获装置和图像捕获元件

    公开(公告)号：EP3220627A1

    公开(公告)日：2017-09-20

    申请号：EP15858779.0

    申请日：2015-11-10

    申请人： Nikon Corporation

    发明人： NAKANISHI, Sota ,  FUNAMIZU, Wataru ,  OKAMOTO, Kazuya ,  TSUNAI, Shiro ,  SUGAYA, Isao

    IPC分类号： H04N5/369 ,  H01L27/14

    CPC分类号： H04N5/243 ,  H01L27/14 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14645 ,  H04N5/2357 ,  H04N5/3745

    摘要： Provided is a light detecting apparatus including: a first photoelectric converting unit which outputs a first electrical signal in accordance with an incident light including a modulated light component and a background light component; a filter unit which outputs a second electrical signal resulting from the modulated light component being reduced in the incident light; and a signal processing unit which subtracts the second electrical signal from the first electrical signal to reduce a component corresponding to the background light component in the first electrical signal. In the light detecting apparatus described above, the photoelectric converting unit may include a first photoelectric converting element and a second photoelectric converting element each of which outputs the first electrical signal, the filter unit may attenuate the signal corresponding to the modulated light component in the first electrical signal output from the second photoelectric converting element, and the signal processing unit may subtract the second electrical signal from the first electrical signal output from the first photoelectric converting element.

    摘要翻译： 提供一种光检测设备，包括：第一光电转换单元，其根据包括调制光分量和背景光分量的入射光来输出第一电信号; 滤波器单元，其输出由在入射光中被减小的调制光分量导致的第二电信号; 以及信号处理单元，其从第一电信号中减去第二电信号以减少与第一电信号中的背景光分量对应的分量。 在上述光检测设备中，光电转换单元可以包括输出第一电信号的第一光电转换元件和第二光电转换元件，滤波器单元可以衰减对应于第一电信号中的调制光分量的信号 从第二光电转换元件输出的电信号，并且信号处理单元可以从第一光电转换元件输出的第一电信号中减去第二电信号。

    SUBSTRATE BONDING APPARATUS, ALIGNING APPARATUS, SUBSTRATE BONDING METHOD, ALIGNING METHOD, AND LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    4.
    发明公开
    SUBSTRATE BONDING APPARATUS, ALIGNING APPARATUS, SUBSTRATE BONDING METHOD, ALIGNING METHOD, AND LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
    基板贴合装置，定位装置，衬底键合方法中，层叠的半导体部件排列方法和手段

    公开(公告)号：EP2913841A1

    公开(公告)日：2015-09-02

    申请号：EP13849822.5

    申请日：2013-10-25

    申请人： Nikon Corporation

    发明人： OKAMOTO, Kazuya ,  SUGAYA, Isao

    IPC分类号： H01L21/02 ,  H01L21/68

    CPC分类号： B32B41/00 ,  B32B37/0046 ,  B32B37/18 ,  B32B38/18 ,  H01L21/67092 ,  H01L21/681

    摘要： Misalignment of substrates may occur even though the substrates are precisely aligned together due to the factors after the alignment. A substrate bonding apparatus for bonding a first substrate and a second substrate together comprises an aligning section which aligns the first substrate and the second substrate together in an aligning apparatus; a carrying section that carries out the first substrate and the second substrate from an aligning section that have been aligned; a bonding section that bonds the first substrate and the second substrate together that have been carried by the carrying section; a judging section that judges whether there is misalignment of the first substrate and the second substrate prior to being carried by the carrying section, after alignment in the aligning section.

    摘要翻译： 所述衬底的未对准可能会出现即使基板由于对准后的因素一起精确地对准。 用于在对准装置接合第一基板和第二基板彼此对齐部，其对准所述第一基板和所述第二基板的包含在一起的基板接合装置; 一个承载部并进行所述第一基板和所述第二基板从在对准部thathave被对准; 接合部分键所做的第一基板和一起thathave已由传送部件传送的第二基板; 一判断部判断做是否有之前由承载部正在执行，在对准部对准后的第一基板和所述第二基板的未对准。