公开(公告)号：EP2546055A4

公开(公告)日：2013-05-22

申请号：EP11753174

申请日：2011-02-21

申请人： OMRON TATEISI ELECTRONICS CO

发明人： MASUTANI NAOKI ,  NAKAJIMA SEIJI ,  FUKUHARA TOMOHIRO ,  SUMIYA AKIO ,  NISHIKAWA KAZUYOSHI

IPC分类号： B32B15/08 ,  C09J5/10 ,  G01K1/08 ,  G01K7/00

CPC分类号： B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  C09J5/00 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/00 ,  C09J2463/00 ,  G01K1/08 ,  Y10T428/239 ,  Y10T428/24612 ,  Y10T428/269 ,  Y10T428/31678

摘要： The present invention provides (A) an electronic part including a metal part combined with a non-metal part so as to cover the non-metal part, which electronic part can be assembled (i) with excellent workability, (ii) without requiring a high-temperature condition, and (iii) in a short period of time and (B) a method for manufacturing the electronic part. An electronic part (10) in accordance with the present invention includes (I) a non-metal part (11) and (II) a metal part (14) covering a covered region (11b) provided on a surface of the non-metal part (11). The covered region (11b) and the metal part (14) are combined together via an adhesive layer (12) provided by curing an ultraviolet anaerobic curing adhesive containing a photopolymerization initiator and organic peroxide.

公开(公告)号：EP2505610A4

公开(公告)日：2015-07-01

申请号：EP10833021

申请日：2010-10-27

申请人： OMRON TATEISI ELECTRONICS CO

发明人： OHTANI OSAMU ,  FUKUHARA TOMOHIRO ,  NAKAJIMA SEIJI

IPC分类号： C08L63/00 ,  C08G59/40 ,  C08K3/00 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09K3/10

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08K3/013 ,  C08K5/3155 ,  C08K2201/005 ,  C09K3/10 ,  C09K2200/0647 ,  Y10T428/31515

摘要： An epoxy resin composition in accordance with the present invention is a one-part epoxy resin composition for hermetic sealing of an electronic component or an electrical component, containing: a liquid epoxy resin; dicyandiamide; and a filler, the filler having an average particle size between 0.1 µm and 1 µm, the filler containing particles not less than 5 µm in particle size in an amount of not more than 20 wt%, and the amount of the filler contained in the one-part epoxy resin composition being between 5 and 60 parts by weight relative to 100 parts by weight of the liquid epoxy resin. This achieves a one-part liquid epoxy resin composition in which a great variety of curing agents can be used and dissociation of an epoxy resin and a curing agent is suppressed even when used in a gap of approximately several tens of micrometers.

公开(公告)号：EP2251369A4

公开(公告)日：2011-03-16

申请号：EP09716206

申请日：2009-02-23

申请人： OMRON TATEISI ELECTRONICS CO

发明人： ITO MITSUO ,  FUKUHARA TOMOHIRO ,  NAKAJIMA SEIJI

IPC分类号： C08G59/40 ,  C08K3/04 ,  C08K5/1515 ,  C08K9/06 ,  C08L63/00 ,  H01H45/02 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01H9/04 ,  C08G59/4021 ,  C08G59/686 ,  C08K5/3445 ,  C08L63/00 ,  H01H50/023 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T29/49144 ,  Y10T428/31515 ,  H01L2924/00