公开(公告)号：EP3118236A4

公开(公告)日：2017-10-25

申请号：EP14885174

申请日：2014-11-06

申请人： OMRON TATEISI ELECTRONICS CO

发明人： NAKAJIMA SEIJI ,  TATSUNO YOSUKE ,  ITO MITSUO ,  HIRONO SATOSHI ,  MORISAKI YUZO ,  KAWAMOTO JUNJI

IPC分类号： C08G59/40 ,  C08G59/18 ,  C08G59/24 ,  C08G59/50 ,  C08G59/68 ,  C08J3/24 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K7/20 ,  C08L63/00 ,  C08L63/02

CPC分类号： C08K3/36 ,  C08G59/188 ,  C08G59/245 ,  C08G59/5033 ,  C08G59/686 ,  C08J3/241 ,  C08J2363/02 ,  C08K3/013 ,  C08K3/04 ,  C08K3/22 ,  C08K3/40 ,  C08K5/3417 ,  C08K7/20 ,  C08K2003/2265 ,  C08L63/00 ,  C08L67/02

摘要： The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

公开(公告)号：EP3118237A4

公开(公告)日：2017-11-22

申请号：EP14885219

申请日：2014-11-06

申请人： OMRON TATEISI ELECTRONICS CO

发明人： NAKAJIMA SEIJI ,  TATSUNO YOSUKE ,  ITO MITSUO ,  HIRONO SATOSHI ,  MORISAKI YUZO ,  KAWAMOTO JUNJI

IPC分类号： C08J3/24 ,  B29C35/08 ,  C09J163/00

CPC分类号： B32B37/1207 ,  B29C2035/0838 ,  B32B7/12 ,  B32B15/09 ,  B32B15/092 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B27/26 ,  B32B27/365 ,  B32B27/38 ,  B32B38/0008 ,  B32B2037/1253 ,  B32B2250/02 ,  B32B2250/244 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2307/302 ,  B32B2307/402 ,  B32B2310/0843 ,  B32B2311/00 ,  B32B2363/00 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2457/00 ,  B32B2581/00 ,  C08G59/188 ,  C08G59/245 ,  C08G59/5033 ,  C08G59/686 ,  C08J3/241 ,  C08J2363/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/36 ,  C08K3/40 ,  C08K5/00 ,  C08K7/20 ,  C08K2003/2265 ,  C08L63/00 ,  C09J5/00 ,  C09J11/00 ,  C09J163/00

摘要： The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

公开(公告)号：EP2251369A4

公开(公告)日：2011-03-16

申请号：EP09716206

申请日：2009-02-23

申请人： OMRON TATEISI ELECTRONICS CO

发明人： ITO MITSUO ,  FUKUHARA TOMOHIRO ,  NAKAJIMA SEIJI

IPC分类号： C08G59/40 ,  C08K3/04 ,  C08K5/1515 ,  C08K9/06 ,  C08L63/00 ,  H01H45/02 ,  H01L23/29 ,  H01L23/31

CPC分类号： H01H9/04 ,  C08G59/4021 ,  C08G59/686 ,  C08K5/3445 ,  C08L63/00 ,  H01H50/023 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T29/49144 ,  Y10T428/31515 ,  H01L2924/00

公开(公告)号：EP1630180A4

公开(公告)日：2006-06-21

申请号：EP04734608

申请日：2004-05-24

申请人： OMRON TATEISI ELECTRONICS CO

发明人： KITAMURA KYOJI ,  ITO MITSUO

IPC分类号： C08F222/10 ,  G02B6/12 ,  G02B6/138 ,  C08F220/20 ,  G02B1/04

CPC分类号： C08F222/1006 ,  G02B6/138 ,  G02B2006/121

摘要： Disclosed is a curing resin composition which is excellent in heat-resistant properties such as thermal decomposition resistance and coloring resistance and suitable for forming an optical component whose refractive index is precisely controlled, especially for forming an optical waveguide. The curing resin composition contains, as the indispensable components, (A) a monomer having a polycyclic alicyclic hydrocarbon skeleton and two or more terminal radical polymerizable groups, (B) a monomer having a perfluoroalkylene skeleton and two or more terminal radical polymerizable groups, and (C) a photopolymerization initiator or/and a thermal polymerization initiator. An optical component, in particular an optical waveguide which is produced by photopolymerizing or/and thermally polymerizing this curing resin composition is also disclosed.