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1.发明公开METHODS TO PRODUCE HIGH DENSITY, MULTILAYER PRINTED WIRING BOARDS FROM PARALLEL-FABRICATED CIRCUITS AND FILLED VIAS 审中-公开工艺生产高密度多层电路板从并行，制造的电路并填充连接孔
公开(公告)号：EP2114579A4
公开(公告)日：2013-03-27
申请号：EP07863298
申请日：2007-12-28
Applicant: ORMET CIRCUITS INC
Inventor： HOLCOMB KEN
CPC classification number: H05K3/4614 , H05K3/386 , H05K3/4069 , H05K3/4602 , H05K3/462 , H05K3/4652 , H05K2201/0195 , H05K2201/0394 , H05K2201/10378 , H05K2203/061 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T156/1056
Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
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