Abstract:
A composite substrate (1) comprising a substrate body (2) and a utility layer (31) fixed on the substrate body (2). A planarization layer (4) is arranged between the utility layer (31) and the substrate body (2). A method for producing a composite substrate (1) applies a planarization layer (4) on a provided utility substrate (3). The utility substrate (3) is fixed on a substrate body (2) for the composite substrate (1). The utility substrate (3) is subsequently separated, wherein a utility layer (31) of the utility substrate (3) remains for the composite substrate (1) on the substrate body (2).
Abstract:
The application relates to an optoelectronic semiconductor chip (20) comprising the following sequence of regions in a growth direction (σ) of the semiconductor chip (20): - a p-doped barrier layer (1), for an active region (2), - the active region (2), which is suitable for generating electromagnetic radiation, the active region being based on a hexagonal compound semiconductor, and - an n-doped barrier layer (3) for the active region (2). The application furthermore relates to a component comprising such a semiconductor chip (20) and to a method for producing such a semiconductor chip (20).