Saw filter encapsulated in a ceramic package with capacitance incorporated therein
    4.
    发明公开
    Saw filter encapsulated in a ceramic package with capacitance incorporated therein 失效
    在Keramikpackung eingekapseltes akustischesOberflächenwellenfiltermit darin eingebauterKapazität

    公开(公告)号:EP1653613A1

    公开(公告)日:2006-05-03

    申请号:EP05110513.8

    申请日:1997-02-07

    CPC classification number: H03H9/1071 H03H9/6433

    Abstract: In a ceramic package (10) for a SAW (surface acoustic wave) filter, a metal pad (17) is formed on the bottom (10D) of a recess (10C) formed in the package (10). A SAW filter chip (31) is mounted to the package (10) such that propagation paths (33) formed on the chip (31) face the bottom (31D) of the recess (31C) with the intermediary of a gap. The gap promotes easy impedance adjustment.

    Abstract translation: 在用于SAW(表面声波)滤波器的陶瓷封装(10)中,在形成在封装(10)中的凹部(10C)的底部(10D)上形成金属焊盘(17)。 SAW滤波器芯片(31)安装到封装(10)上,使得形成在芯片(31)上的传播路径(33)以间隙的方式面向凹部(31C)的底部(31D)。 间隙促进容易的阻抗调整。

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