PATTERNING OF ELECTRODES IN OLED DEVICES
    2.
    发明公开
    PATTERNING OF ELECTRODES IN OLED DEVICES 有权
    铅在OLED组件结构

    公开(公告)号:EP1317874A1

    公开(公告)日:2003-06-11

    申请号:EP00963240.7

    申请日:2000-09-06

    IPC分类号: H05B33/12

    摘要: An OLED device (200) having pillars (270) with cross section that is wider on the top. The pillars (270) structure a conductive layer (215) during deposition into distinct portions (215a, 215b) located between the pillars and on the top of the pillars. The pillars (270) are formed by patterning a single photosensitive material which is inert to the chemicals used to deposit the organic functional layers (210) of the OLED device (200). By using such pillars (270), the electrodes (215) can be formed without damaging organic functional layers (210) while achieving high resolution.

    METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE AND ORGANIC ELECTRONIC DEVICE
    3.
    发明公开
    METHOD FOR MANUFACTURING AN ORGANIC ELECTRONIC DEVICE AND ORGANIC ELECTRONIC DEVICE 审中-公开
    方法制备有机电泗成分和与有机电子部件

    公开(公告)号:EP1658649A1

    公开(公告)日:2006-05-24

    申请号:EP04763932.3

    申请日:2004-08-09

    IPC分类号: H01L51/40 H01L51/52

    摘要: The invention discloses a method for manufacturing an organic electro-luminescent display device, the method comprising the steps of: providing a light-permeable substrate; arranging a plurality of transparent electrodes in a stripe-like manner on the light-permeable substrate, the transparent electrodes being made of a light-permeable con-ductive film; forming at least one organic layer on the subassembly, the at least one organic layer being made of an organic elec-tro-luminescent medium so that the at least one organic layer covers the electrodes; forming a conductive film all over the at least one organic layer; and removing at least one portion of the conductive film so as to create stipe-like electrodes being electrical iso-lated to each other and extending in a direction perpendicu-lar to the transparent electrodes using a radiation method.

    VERFAHREN ZUM HERSTELLEN EINES LUMINESZENZDIODENCHIPS UND LUMINESZENZDIODENCHIP

    公开(公告)号:EP1917686A1

    公开(公告)日:2008-05-07

    申请号:EP06775719.5

    申请日:2006-07-20

    IPC分类号: H01L33/00

    摘要: The invention relates to a method, according to which a base is provided, with a series of layers for an LED chip, suitable to emit electromagnetic radiation. A cover layer is applied to at least one main surface of the base. At least one cavity is introduced into the cover layer, the cavity being completely or partially filled with a luminescence conversion material. The luminescence conversion material uses at least one fluorescent substance. The invention also relates to a method, according to which the cover layer comprises photostructurable material and at least one fluorescent substance, so that it acts as luminescence conversion material and can be directly photostructured. Also disclosed are LED chips that can be produced using said method.

    摘要翻译: 公开了一种方法,其中制备了一种基体,其包含用于LED芯片的层序列并且适于发射电磁辐射。 帽层施加到基体的至少一个主表面。 空腔被引入到盖层中,并且被完全或部分地填充有发光转换材料。 发光转换材料包括至少一种荧光体。 还公开了一种方法,其中盖层包括光可光化材料和至少一种磷光体,使得其能够用作发光转换材料并且可以直接进行光致结晶。 还描述了可通过该方法生产的LED芯片。