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    LENS, LENS UNIT, AND IMAGING DEVICE USING THE SAME
    2.
    发明公开
    LENS, LENS UNIT, AND IMAGING DEVICE USING THE SAME 审中-公开
    镜头，透镜单元和图像设备

    公开(公告)号：EP1965230A4

    公开(公告)日：2010-04-07

    申请号：EP06834012

    申请日：2006-12-05

    申请人： PANASONIC CORP

    发明人： NISHIZAWA HIROSHI ,  IMAI MAKOTO

    IPC分类号： G02B3/02 ,  B29D11/00 ,  G02B1/04

    CPC分类号： C03B11/08 ,  C03B2215/404 ,  C03B2215/49 ,  G02B3/04 ,  G02B7/023 ,  G02B7/025 ,  Y02P40/57

    摘要： A lens is provided which is configured so that the dimensional accuracy of the lens surface can be evaluated easily and accurately, and the control of the accuracy of the lens can be easily performed. The lens comprises a lens effective part having lens surfaces formed around an optical axis as the center and an edge part in a doughnut shape as viewed in a plan view, which is extended along the outer periphery of the lens effective part. The edge part and the lens effective part are molded simultaneously, and annular indices around the optical axis as the center, with which the dimensional accuracy of the lens surfaces can be detected, are formed on both the surfaces of the edge part.

    IMAGING DEVICE, METHOD FOR MANUFACTURING THE IMAGING DEVICE AND CELLULAR PHONE
    3.
    发明公开
    IMAGING DEVICE, METHOD FOR MANUFACTURING THE IMAGING DEVICE AND CELLULAR PHONE 审中-公开
    插图装置，其制造方法绘制设备和手机

    公开(公告)号：EP2063629A4

    公开(公告)日：2012-02-22

    申请号：EP07829169

    申请日：2007-10-04

    申请人： PANASONIC CORP

    发明人： IMAI MAKOTO ,  NISHIZAWA HIROSHI

    IPC分类号： H04N5/225 ,  H01L27/14 ,  H04N5/335 ,  H04N5/361

    CPC分类号： H01L27/1462 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/3696 ,  H04N2007/145 ,  H01L2924/00

    摘要： An imaging device includes a lens (3), an optical filter (5), a semiconductor imaging element (4) having a light receiving section, and a tridimensional substrate (2) on which the semiconductor imaging element (4) and the optical filter (5) are mounted, wherein the tridimensional substrate (2) has an opening (14) corresponding to the light receiving section of the semiconductor imaging element (4), the semiconductor imaging element (4) and the optical filter (5) are located on one side of the opening (14), the lens (3) is located on the other side of the opening (14), and the semiconductor imaging element (4) and the optical filter (5) are fixed to the tridimensional substrate (2) under the condition that the semiconductor imaging element (4) and the optical filter (5) are curved, and have respective centers moved in a direction away from the lens (3).