公开(公告)号：EP2515091A1

公开(公告)日：2012-10-24

申请号：EP10837702.9

申请日：2010-12-17

申请人： Panasonic Corporation

发明人： UEDA Mitsuhiko ,  OKUBAYASHI Takami ,  SUGIYAMA Takanori ,  SANAGAWA Yoshiharu ,  AKETA Takanori ,  NAKAMURA Yushi ,  KIRIHARA Masao

IPC分类号： G01J1/02

CPC分类号： G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： Provided is an infrared sensor module capable of reducing thermal noise and detecting infrared radiation with high accuracy and high reliability.
An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which comprises a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between: the infrared sensor device; and the case and the signal processing circuit device, and which comprises a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

摘要翻译： 提供了一种能够以高精度和高可靠性降低热噪声并检测红外辐射的红外传感器模块。 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离的金属外壳，该金属外壳包括一个光入射窗口，该光入射窗口设置有用于将红外传感器装置上的图像与外部红外信号耦合的光学系统，并且容纳红外线传感器装置和 信号处理电路装置; 以及传感器盖，其设置在所述红外线传感器装置之间; 壳体和信号处理电路装置，其包括被配置为将经由光学系统进入的红外线信号引导到红外线传感器装置的光透射部。