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    Thermally-conductive epoxy resin molded article and method of producing the same
    4.
    发明公开
    Thermally-conductive epoxy resin molded article and method of producing the same 有权
    导热环氧树脂的模塑制品，和过程及其制备

    公开(公告)号：EP1481999A2

    公开(公告)日：2004-12-01

    申请号：EP04009823.8

    申请日：2004-04-26

    申请人： Polymatech Co., Ltd.

    发明人： Tobita, Masayuki ,  Kimura, Toru ,  Ishigaki, Tsukasa ,  Shimoyama, Naoyuki ,  Aoki, Hisashi ,  Ochi, Mitsukazu ,  Harada, Miyuki

    IPC分类号： C08G59/28 ,  C08G59/32

    CPC分类号： C08G59/28 ,  C08G59/5033 ,  Y10T428/31 ,  Y10T428/31511

    摘要： A thermally-conductive epoxy resin molded article (11) comprises an epoxy resin having molecular chains that contain an azomethine group (-CH=N-). The molded article (11) has a thermal conductivity in a range of 0.5 to 30 W/(m·K). It is preferred that the molecular chains of the epoxy resin are oriented in a specific direction, and in that direction, the molded article (11) has a thermal conductivity in a range of 0.5 to 30 W/(m·K). The thermally-conductive epoxy resin molded article (11) is produced by applying a magnetic field to the epoxy resin composition (15) to orient the molecular chains of the epoxy resin in a specific direction and then curing the epoxy resin composition (15).

    摘要翻译： 导热环氧树脂模制品（11），其具有分子链的环氧树脂包括的确含有在甲亚胺基基团（-CH = N-）。 的模制品（11）具有范围为0.5至30 W /（米·K）的热导率。 它是优选的，DASS模具的环氧树脂的分子链在特定方向上被定向，和DASS方向，模制品（11）具有范围为0.5至30 W /（米·K）的热导率。 导热环氧树脂模制件（11）通过施加磁场到的环氧树脂组合物（15）以定向环氧树脂的分子链在特定方向上，然后固化所述环氧树脂组合物（15）中产生。

    Thermally-conductive epoxy resin molded article and method of manufacturing the same
    5.
    发明公开
    Thermally-conductive epoxy resin molded article and method of manufacturing the same 有权
    Thermischleitfähigeraus Epoxidharz gegossener Artikel und Herstellunsververfahren desselben

    公开(公告)号：EP1424383A1

    公开(公告)日：2004-06-02

    申请号：EP03256089.8

    申请日：2003-09-27

    申请人： Polymatech Co., Ltd.

    发明人： Tobita, Masayuki ,  Shimoyama, Naoyuki ,  Ishigaki, Tsukasa ,  Aoki, Hisashi ,  Kimura, Toru ,  Ochi, Mitsukazu

    IPC分类号： C09K19/38 ,  C08G59/24 ,  C09K19/54

    CPC分类号： H01L23/3737 ,  C09K19/388 ,  C09K19/52 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermally-conductive epoxy resin molded article conducting heat generated from electronic components and the like, and a method of manufacturing the same are disclosed. The thermally-conductive epoxy resin molded article according to the present invention is obtained by curing an epoxy resin composition containing an epoxy resin. The epoxy resin contained in the thermally-conductive epoxy resin molded article has the degree of orientation α equal to or larger than 0.5 and smaller than 1.0. The degree of orientation α is determined by the following equation: degree of orientation α = (180 - Δβ)/180 wherein Δβ represents a half-width of a peak in an intensity distribution measured by fixing to a peak scattering angle in an x-ray diffraction measurement, and then changing an azimuth angle from 0 degree to 360 degrees.

    摘要翻译： 公开了一种导电性环氧树脂成型体，其由电子部件等产生的热量及其制造方法。 本发明的导热性环氧树脂成型体是将含有环氧树脂的环氧树脂组合物固化而得到的。 包含在导热环氧树脂模制品中的环氧树脂具有等于或大于0.5且小于1.0的取向度α。 取向度α由以下等式确定：取向度α=（180-DELTAβ）/ 180 其中，ΔTA表示峰的半峰宽 在通过在x射线衍射测量中固定为峰值散射角测量的强度分布中，然后将方位角从0度改变到360度。