公开(公告)号：EP3510596A1

公开(公告)日：2019-07-17

申请号：EP17755399.7

申请日：2017-08-11

申请人： Qualcomm Incorporated

发明人： LIANG, Bin ,  KWOK, Tony Chung Yiu ,  LI, Rui ,  YOON, Sei Seung

IPC分类号： G11C7/22 ,  G11C8/18 ,  G11C11/418 ,  G11C11/419

摘要： A memory is disclosed. The memory includes a memory array having a plurality of memory cells. The memory also includes an address decoder configured to assert a wordline to enable the memory cells. Additionally, the memory includes a tracking circuit configured to vary a duration of asserting the wordline as a function of which one of the memory cells is accessed. A method is also disclosed. The method includes asserting a wordline to enable the memory cells and varying a duration of asserting the wordline as a function of which one of a plurality of memory cells is accessed.

公开(公告)号：EP3281084A1

公开(公告)日：2018-02-14

申请号：EP16712138.3

申请日：2016-03-10

申请人： Qualcomm Incorporated

发明人： PATIL, Sanjay Bhagawan ,  STASIAK, Daniel ,  SAINT-LAURENT, Martin Pierre ,  LI, Rui ,  LIANG, Bin ,  YOON, Sei Seung ,  JUNG, Chulmin

IPC分类号： G06F1/32 ,  H02M1/32

CPC分类号： G05F1/10 ,  G06F1/26 ,  G06F1/263 ,  G06F1/3287 ,  G06F1/329 ,  H02M1/32

摘要： Voltage droop control is disclosed. A device includes a first component coupled to an external power supply and a second component coupled to the external power supply. The first component includes a first input configured to receive a first voltage, a first internal power supply configured to be charged by the external power supply in response to the first voltage corresponding to a first logical value, and a voltage droop controller configured to output a second voltage via a first output. The second voltage corresponds to the first logical value in response to a first voltage level of the first internal power supply satisfying a second voltage level. The second component includes a second input configured to receive the second voltage from the first output.

公开(公告)号：EP4285366A1

公开(公告)日：2023-12-06

申请号：EP22703132.5

申请日：2022-01-12

申请人： QUALCOMM INCORPORATED

发明人： LI, Rui ,  LU, De ,  NARAYANAN, Venkat

IPC分类号： G11C19/28 ,  H03K3/356

公开(公告)号：EP4074105A1

公开(公告)日：2022-10-19

申请号：EP20829494.2

申请日：2020-12-11

申请人： QUALCOMM INCORPORATED

发明人： VENKATACHARI, Harish ,  MINERO, Paolo ,  LI, Rui ,  MA, Qian ,  PANY, Antriksh ,  AZMOODEH, Masoud ,  FU, Yu ,  ALUR SREESHA, Ashwin ,  PATEL, Rimal ,  CHITRANSH, Arpit

IPC分类号： H04W52/04 ,  H04W52/52 ,  H03G3/00 ,  H04W52/24 ,  H04W88/06

公开(公告)号：EP3656060A1

公开(公告)日：2020-05-27

申请号：EP18732196.3

申请日：2018-05-21

申请人： QUALCOMM Incorporated

发明人： ZHUO, Wei ,  GATHMAN, Timothy Donald ,  XU, Wenbang ,  CHANG, Li-chung ,  LI, Rui ,  KARMAKER, Rahul

IPC分类号： H04B1/10 ,  H04L5/00 ,  H04B1/00 ,  H04B1/30 ,  H03D3/00 ,  H03D7/16

公开(公告)号：EP3510596B1

公开(公告)日：2020-01-22

申请号：EP17755399.7

申请日：2017-08-11

申请人： Qualcomm Incorporated

发明人： LIANG, Bin ,  KWOK, Tony Chung Yiu ,  LI, Rui ,  YOON, Sei Seung

IPC分类号： G11C7/22 ,  G11C8/18 ,  G11C11/418 ,  G11C11/419 ,  G11C7/10