公开(公告)号：EP1093328A2

公开(公告)日：2001-04-18

申请号：EP00308916.6

申请日：2000-10-10

Applicant: ROHM AND HAAS COMPANY

Inventor： Nacker, Wayne E. ,  Carpenter, Richard W.

IPC: H05K3/02 ,  H05K1/16 ,  H01L21/48

CPC classification number: H05K1/167 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/027 ,  H05K3/20 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0338

Abstract: To form thin film electrical components, a thin film having desired electrical properties is deposited on a substrate of dissimilar material. Thermal energy from a computer guided laser is used to remove selected portions of the thin film.
In accordance with one aspect of the invention, the thin film is an electrically conducting material, such as platinum or doped platinum, and the substrate is metal foil, such as copper foil. The thermal energy from the laser ablates away portions of the thin film.
In accordance with another aspect of the invention, a layer of zero valence metal is deposited on a dielectric material substrate which has a melting point or decomposition temperature substantially above that of the zero valence metal. The zero valence metal layer is patterned to form electronic circuitry components by computer guided laser which provides sufficient thermal energy to boil away selected portions of the zero valence metal layer.
In one preferred embodiment, electronic circuitry is formed from a three-layer composite comprising nickel foil; a dielectric material, such as silica deposited on the foil; and a zinc layer deposited on the dielectric material. The zinc layer, having a boiling point substantially below the melting points of the dielectric material and the nickel foil, is patterned by laser-derived thermal energy.

Abstract translation: 为了形成薄膜电气部件，将具有期望的电性能的薄膜沉积在不同材料的基板上。 使用来自计算机引导激光的热能来去除所选择的薄膜部分。 根据本发明的一个方面，薄膜是诸如铂或掺杂铂的导电材料，并且衬底是诸如铜箔的金属箔。 来自激光器的热能消除了薄膜的部分。 根据本发明的另一方面，一种零价金属层沉积在电介质材料基片上，其熔点或分解温度基本上高于零价金属的熔点或分解温度。 将零价金属层图案化以通过计算机引导激光器形成电子电路部件，该激光器提供足够的热能来去除零价金属层的选定部分。 在一个优选实施例中，电子电路由包括镍箔的三层复合材料形成; 介电材料，例如沉积在箔上的二氧化硅; 以及沉积在电介质材料上的锌层。 具有基本上低于介电材料和镍箔的熔点的沸点的锌层通过激光衍生的热能来图案化。

公开(公告)号：EP1092479A1

公开(公告)日：2001-04-18

申请号：EP00308699.8

申请日：2000-10-03

Applicant: ROHM AND HAAS COMPANY

Inventor： White, Gerald K. ,  Nacker, Wayne E. ,  Allen, Karen D.

IPC: B05D1/38

CPC classification number: B05D7/546 ,  B05D5/06 ,  B05D5/061 ,  B05D5/065 ,  B05D5/067 ,  B05D7/06 ,  C09D5/032 ,  C09D5/033 ,  D21H19/38 ,  D21H23/50

Abstract: A heat-sensitive substrate is coated with a first, low-temperature curing coating powder and a second, high-temperature curing coating powder. The time/temperature conditions of fusing and curing the low-temperature coating powder permit the substrate to retain its character and thus suffer no essential damage to the character of the substrate. The time/temperature conditions of fusing and curing the high-temperature coating powder would so damage the substrate if the high temperature curing coating powder were applied, fused, and cured, directly on the substrate. However, the coating provided by the low-temperature curing powder protects the substrate from detriment when the high-temperature curing coating powder is fused and cured thereon.

Abstract translation: 热敏基材涂覆有第一低温固化涂料粉末和第二高温固化涂料粉末。 熔融和固化低温涂层粉末的时间/温度条件允许基材保持其特性，从而不会对基材的特性造成必要的损害。 如果将高温固化涂料粉末直接施加，熔融和固化在基材上，则熔融和固化高温涂料粉末的时间/温度条件将损坏基材。 然而，当高温固化涂料粉末在其上熔融和固化时，由低温固化粉末提供的涂层可保护基材免受损害。

公开(公告)号：EP1093328A3

公开(公告)日：2003-08-13

申请号：EP00308916.6

申请日：2000-10-10

Applicant: ROHM AND HAAS COMPANY

Inventor： Nacker, Wayne E. ,  Carpenter, Richard W.

IPC: H05K3/02 ,  H05K1/16 ,  H01L21/48

CPC classification number: H05K1/167 ,  H01L21/4846 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/027 ,  H05K3/20 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0338

Abstract: To form thin film electrical components, a thin film having desired electrical properties is deposited on a substrate of dissimilar material. Thermal energy from a computer guided laser is used to remove selected portions of the thin film. In accordance with one aspect of the invention, the thin film is an electrically conducting material, such as platinum or doped platinum, and the substrate is metal foil, such as copper foil. The thermal energy from the laser ablates away portions of the thin film. In accordance with another aspect of the invention, a layer of zero valence metal is deposited on a dielectric material substrate which has a melting point or decomposition temperature substantially above that of the zero valence metal. The zero valence metal layer is patterned to form electronic circuitry components by computer guided laser which provides sufficient thermal energy to boil away selected portions of the zero valence metal layer. In one preferred embodiment, electronic circuitry is formed from a three-layer composite comprising nickel foil; a dielectric material, such as silica deposited on the foil; and a zinc layer deposited on the dielectric material. The zinc layer, having a boiling point substantially below the melting points of the dielectric material and the nickel foil, is patterned by laser-derived thermal energy.