公开(公告)号：EP2711971B1

公开(公告)日：2016-11-16

申请号：EP12185564.7

申请日：2012-09-21

Applicant: JUMO GmbH & Co. KG

Inventor： Wolf, Andreas

IPC: H01L21/027 ,  H05K3/04

CPC classification number: H01L21/0272 ,  H05K3/048 ,  H05K2201/0116 ,  H05K2201/0317 ,  H05K2203/0545 ,  H05K2203/0746

公开(公告)号：EP2752505B1

公开(公告)日：2016-03-23

申请号：EP12829006.1

申请日：2012-08-30

Applicant: JX Nippon Mining & Metals Corporation

Inventor： NAGAURA, Tomota ,  SAKAGUCHI, Kazuhiko

IPC: C23C28/00 ,  B32B15/01 ,  C25D7/06 ,  C25D5/14 ,  C25D1/04 ,  C25D9/08 ,  H05K1/09 ,  C23C28/02 ,  C23C18/16 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/58 ,  C25D3/56 ,  H05K3/02 ,  C25D11/38

CPC classification number: H05K1/09 ,  B32B15/01 ,  C23C18/165 ,  C23C18/31 ,  C23C28/023 ,  C25D1/04 ,  C25D3/04 ,  C25D3/12 ,  C25D3/14 ,  C25D3/16 ,  C25D3/38 ,  C25D3/562 ,  C25D3/565 ,  C25D3/58 ,  C25D5/14 ,  C25D7/0614 ,  C25D9/08 ,  C25D11/38 ,  H05K3/025 ,  H05K2201/0317 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0307 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12611 ,  Y10T428/12667 ,  Y10T428/12861 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/12958 ,  Y10T428/24917

Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 µg/dm 2 of Ni and said Cr layer containing 10-100 µg/dm 2 of Cr is provided.

公开(公告)号：EP2682948A4

公开(公告)日：2014-08-13

申请号：EP12754621

申请日：2012-03-02

Applicant: LG CHEMICAL LTD

Inventor： KOO BEOM MO ,  HWANG JI YOUNG ,  JANG SONG HO ,  PARK JIN WOO ,  KIM CHUNG WAN ,  LEE SEUNG HEON

IPC: H01B1/02 ,  G06F3/041 ,  H01B5/14 ,  H01B13/00 ,  H01L31/0216 ,  H01L31/042

CPC classification number: H05K1/0274 ,  G06F3/041 ,  G06F3/044 ,  G06F3/045 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/08 ,  H01L31/02366 ,  H01L31/05 ,  H01L31/18 ,  H02S40/38 ,  H03K17/962 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/09 ,  H05K3/10 ,  H05K3/16 ,  H05K3/4644 ,  H05K7/02 ,  H05K2201/0317 ,  Y10T29/49155

Abstract: An exemplary embodiment of the present invention relates to a conductive structure body that comprises a darkening pattern layer having AlOxNy, and a method for manufacturing the same. The conductive structure body according to the exemplary embodiment of the present invention may prevent reflection by a conductive pattern layer without affecting conductivity of the conductive pattern layer, and improve a concealing property of the conductive pattern layer by improving absorbance. Accordingly, a display panel having improved visibility may be developed by using the conductive structure body according to the exemplary embodiment of the present invention.

公开(公告)号：EP2222144B1

公开(公告)日：2014-07-30

申请号：EP10004994.9

申请日：2007-06-29

Applicant: SHIN-ETSU POLYMER CO., LTD.

Inventor： Kawaguchi, Toshiyuki ,  Tahara, Kazutoki ,  Saga, Tsutomu ,  Negishi, Mitsuaki

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

公开(公告)号：EP2448382A4

公开(公告)日：2014-03-19

申请号：EP09846484

申请日：2009-06-23

Applicant: TOSHIBA MITSUBISHI ELEC INC

Inventor： YOSHIDA AKIO ,  KOGURA MASAHISA

IPC: H05K3/10 ,  B23K20/10 ,  H01R4/02 ,  H01R4/62 ,  H01R43/02 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01R4/029 ,  B23K20/106 ,  H01R4/62 ,  H01R43/0207 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/328 ,  H05K3/38 ,  H05K3/4015 ,  H05K2201/0317 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2203/0195 ,  H05K2203/0285

公开(公告)号：EP1037511B1

公开(公告)日：2012-07-18

申请号：EP00302147.4

申请日：2000-03-16

Applicant: JX Nippon Mining & Metals Corp.

Inventor： Merchant, Harish D. ,  Poutasse, Charles A. ,  Lee, Chin-Ho

IPC: H05K1/00 ,  H05K3/38

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/028 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/0723

公开(公告)号：EP2056656A3

公开(公告)日：2012-03-14

申请号：EP08018242.1

申请日：2008-10-17

Applicant: Leonhard Kurz Stiftung & Co. KG

Inventor： Rohm, Michael ,  Attner, Juri

IPC: H05K3/04 ,  H05K3/38 ,  H05K3/24

CPC classification number: H05K3/046 ,  H05K1/0393 ,  H05K3/244 ,  H05K3/386 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/0329 ,  H05K2203/0522 ,  H05K2203/0525 ,  H05K2203/0528 ,  H05K2203/1545 ,  Y10T428/24802

Abstract: Die Erfindung betrifft ein Verfahren zur Herstellung einer Leiterbahnstruktur auf einer flexiblen Kunststofffolie (51,61,90,95), eine danach hergestellte Leiterbahnstruktur, wobei die Leiterbahnstruktur mittels einer durch Bestrahlung ausgehärteten Kleberschicht (57,93,96) mit der Kunststofffolie verbunden ist und aus einer galvanisch mit mindestens einer Metallschicht (71,72) verstärkten, musterförmigen elektrisch leitenden Dünnfilmschicht (47,94,97) gebildet ist, sowie ein elektronisches Bauelement oder eine elektronische Schaltung mit einer derartigen Leiterbahnstruktur.

Abstract translation: 该方法包括根据图案设计和照射硬化的粘合剂层（57），使得粘合剂层以交联的硬化形式提供。 载体箔从包括薄膜层（47），粘合剂层和塑料箔（51）的箔组分离。 薄膜层保留在塑料箔片和载体箔片的各图案区域中，并从塑料箔片上取出。 形成导电带状结构，同时保留在塑料箔上的薄膜层用金属层（71）电流加强。

公开(公告)号：EP1435658B1

公开(公告)日：2010-05-26

申请号：EP02779905.5

申请日：2002-10-07

Applicant: Tokuyama Corporation

Inventor： YAMAMOTO, Reo ,  KAMIYAMA, Yoshihide

IPC: H01L23/12 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/114 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/246 ,  H05K3/4061 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2201/10674 ,  H05K2203/167 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

公开(公告)号：EP2048919A4

公开(公告)日：2010-01-06

申请号：EP07767924

申请日：2007-06-29

Applicant: SHINETSU POLYMER CO

Inventor： KAWAGUCHI TOSHIYUKI ,  TAHARA KAZUTOKI ,  SAGA TSUTOMU ,  NEGISHI MITSUAKI

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0298 ,  H05K1/167 ,  H05K2201/0191 ,  H05K2201/0317 ,  H05K2201/0326 ,  H05K2201/093 ,  H05K2201/09309

公开(公告)号：EP1817634B1

公开(公告)日：2009-04-08

申请号：EP05811454.7

申请日：2005-11-28

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： MISUMI, Koichi c/o Tokyo Ohka Kogyo Co., Ltd. ,  SAITO, Koji c/o Tokyo Ohka Kogyo Co., Ltd. ,  ISHIKAWA, Kaoru c/o Tokyo Ohka Kogyo Co., Ltd.

IPC: G03F7/11 ,  G03F7/039

CPC classification number: H05K3/108 ,  G03F7/0397 ,  G03F7/11 ,  H05K3/384 ,  H05K2201/0317

Abstract: This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.